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To: semiconeng who wrote (106318)	7/29/2000 2:42:07 PM
From: Dan3	Read Replies (1) \| Respond to of 186894

Re: I guess that I have to explain this to you again. It is far wiser to bring up a new process on a product that is working well... You continue to make my point for me. You appear to be claiming that, as late as next fall, Willamette will not yet be working well. Next fall, Willamette will be a year old processor. When the move was made from .25 to .18, Katmai was pretty much brand new, so Dixon - the most advanced processor Intel had more than two months experience with at that time was used for the production introduction. The other reason for using those .18 wafers for Dixon was that its on-die cache would have made it too large and power hungry for a mobile chip. It made sense to use those wafers for Dixon. Now we've heard plenty about the larger die size and higher power consumption of Willamette. A year from now, unless it has a lot of unsolvable problems, it should be a perfect candidate for .13. But those wafers are going to be used for a Coppermine variation instead. I think that somebody at Intel is very worried about some aspect of Willamette. I don't know if it's performance, scalability, compatibility, infrastructure support, or something else. But it is expected to still be a problem a year from now. Dan

To: semiconeng who wrote (106318)	7/29/2000 3:18:03 PM
From: Jim McMannis	Respond to of 186894

Semicong, RE:"BULL, look again Dan. Dixon was a MOBILE PENTIUM 2 and had NO ON DIE CACHE. Katmai was a PENTIUM 3, and BOTH were running for quite some time on 0.25u before 0.18u was introduced. Coppermine was the FIRST, intel product to feature on-die cache at any process technology, and it was introduced first for Desktops which was widely reported" I believe this to be incorrect information. Dixon was a chip with on die cache, I believe 256k L2. Pretty much the qualifier for the Coppermine albeit without SSE2. Jim