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Technology Stocks : E*TRADE IPO Alert - Y2K and Beyond (EGRP) -- Ignore unavailable to you. Want to Upgrade?

To: amadeus who wrote (6545)	8/3/2000 10:00:20 PM
From: noneed	Respond to of 10270

don't be too quick to dis the packaging sector. this ain't putting bubblewrap around a chip: ostman.com "Company Description We focus exclusively on packaging and test services and offer one of the broadest portfolios of services available in the industry. We are a leader in providing high end packaging solutions, including ball grid array packages, or BGA packages, the most advanced mass produced type of package. We also provide advanced packaging products that address the needs of semiconductors used in wireless and wireline communications applications, including flip-chip, chip-scale and stacked die technologies. Outsourcing of packaging and test services to independent packagers like ChipPAC is expanding rapidly due to several factors, including cost reduction, resource allocation, equipment utilization, time-to-market pressures, the increased technological complexity of packaging and the growth of "fabless" semiconductor manufacturers. Our headquarters are located in Santa Clara, California and our facilities are strategically located in Arizona, South Korea and China, and following the proposed acquisition of the Malaysian business, in Malaysia, to address the needs of our customers who are typically high growth integrated device manufacturers, or IDMs." *** they drive serious revenues, but personally i'd like to see more of a ramp. also, their numbers seem to bounce all over the place - no solid trend. personally i get suspicious of the use of pro forma as adjusted numbers in addition to actual numbers. csfb is in the lead. worth an ioi for that alone.