To: mitch-c who wrote (36365 ) 8/8/2000 9:23:49 PM From: Proud_Infidel Respond to of 70976 It may not be as sexy as 200 or 300mm, but it's still money in the bank: Agilent builds 6-inch fab for new type of chip filter in cell phones Semiconductor Business News (08/08/00, 12:05:00 PM EDT) PALO ALTO, Calif.--Agilent Technologies Inc. today announced it was building a new 6-inch wafer fab in Newark, Calif., which will be dedicated for film-bulk acoustic resonator (FBAR) filter that are used in cellular phone and other wireless products. The spin-off company from Hewlett-Packard Co. also said it was setting up a new high-volume, automated assembly line for the new filter products in Penang, Malaysia. Agilent said its FBAR technology will enable the miniaturization of high-performance filters for duplexers in code division multiple access (CDMA) handsets, operating in the 400-MHz to 1-GHz frequency range. Agilent said its first FBAR product will be released in September and aimed at CDMA-based PCS duplexer applications. The duplexer combines filters that separate transmitted and received signals in cell phones. "Companies have been researching FBAR-type devices for several years," said Bryan Ingram, business unit manager for the Wireless Semiconductor Division at Agilent. He said the company is "commitment to build a dedicated world class production facility shows that we are the first to make this a viable, high-volume technology." According to Agilent, there are currently two main technologies for duplexers -- ceramic and surface acoustic wave (SAW). Agilent said its FBAR duplexer occupies a small fraction of the volume of a ceramic duplexer, and it has better rejection, insertion loss, and power handling characteristics than SAW devices. This combination enables cellular phone manufacturers to produce new, compact handsets with higher performance, added the HP spin-off. Moreover, the FBAR device is based on semiconductor technology, which allows the integration of the filters into the radio-frequency (RF) section of a phone, said Agilent, which added that this enables ultra-small RF modules. "FBAR's combination of small size and high performance has resulted in tremendous pull from customers who are creating the next generation of CDMA handsets," said Dave Allen, vice president of Agilent's Wireless Semiconductor Division. "With this new fab, we intend to stay ahead of this demand so our customers can achieve their expected growth over the next several years." The 6-inch wafer fab is expected to begin volume production in the fourth quarter of 2000. Agilent said it has been working with selected customers to provide early samples of its CDMAdvantage PCS duplexer. General sampling of the device is slated to begin at the end of 2000.