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To: Sr K who wrote (22606)	8/14/2000 8:21:24 AM
From: Paul Lee	Respond to of 25814

LSI Logic Introduces Flip Chip Package for High Bandwidth Communications Applications Newly Developed Package Technology Optimized for High Performance, High Lead Count Chip Designs in the Communications Market MILPITAS, Calif., Aug. 14 /PRNewswire/ -- LSI Logic Corporation (NYSE: LSI) today unveiled its latest innovative organic laminate flip chip package, offering LSI Logic customers significant improvements in thermal and electrical performance over most advanced wire-bond packages. The FPBGA-4L package complements the highly successful FPBGA-HP (high performance flip chip) introduced by LSI Logic in 1998. The FPBGA-4L offers a cost-effective solution for high I/O and performance-demanding ASIC/SOC designs. LSI Logic's expertise in package design, coupled with its close relationships with leading edge package substrate firms, continues to drive the evolution of flip chip packaging. "LSI Logic is defining the standards for SoC packaging, and the establishment of an infrastructure to assemble these packages in high volume is critical to the success of organic flip chip design," said Maniam Alagaratnam, vice president of package development for LSI Logic. "Through licensing agreements with some of the largest assembly and test companies in the world, standardized manufacturing flows have been established resulting in high-volume assembly capability." "We have been investigating activities surrounding the development of technologies to achieve lower cost multi-layer flip-chip packages for ASICs," said Gary Beck, vice president, Shared Systems Products and Engineering Technology, Sun Microsystems, Inc. "LSI Logic has demonstrated that it is a leader in developing the technologies necessary for this package family offering." The FPBGA-4L utilizes a matrix of solder bumps on the active surface of the chip, which connects to the four-layer substrate. The use of solder bump interconnects, as opposed to wire bonding, has demonstrated a reduction in simultaneous switching noise by as much as 50 percent. The backside of the chip is directly connected to a copper heat spreader, providing an excellent source for thermal dissipation. To support the requirements of future communication chip designs, the flip chip package is becoming increasingly important. "As we continuously migrate to highly integrated chip designs using multiple voltages, high-speed I/Os, high-speed memory interfaces and greater power dissipation, the package becomes an integral part of the total solution," said Stan Mihelcic, manager of technology product marketing for LSI Logic. "The FPBGA-4L provides solutions for the diverse needs of the communications infrastructure, including broadband equipment, wireless base stations and LAN systems." FPBGA-4L features: -- 100 percent differential signaling or single ended I/Os -- Separate core, I/O power and ground connections -- Up to 12 voltage splits -- Enhanced thermal performance -- Efficient printed wiring board (PWB) escape routing -- A complete designed generic package family Availability The FPBGA-4L is available immediately, and in high volumes as necessary, to LSI Logic customers in body sizes from 23mm to 40mm, with pin counts from 365 up through 1157.