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To: semiconeng who wrote (4552)	8/11/2000 12:54:30 PM
From: Ali Chen	Read Replies (2) \| Respond to of 275872

semiconeng, <Qualifying the 0.13u process on a product that has 1/2 the throughput of another product would take twice as long.> Thank you for the explanation of stepper technique. However, you seem to be confused with math a little bit. Since the wafer area remains the same, it does not matter how many dies are per field, and the throughput of a stepper in terms of wafer per time remains the same. Certainly you have few Willi chips out of this, but I do not think that fewer samples per wafer would be so critical for "process qualification" unless the yield is in single digits. - Ali

To: semiconeng who wrote (4552)	8/11/2000 12:56:51 PM
From: AK2004	Respond to of 275872

SemiconEng re:There is a certain amount of product that needs to be run through a new Fab, and/or process, in order for intel to "Qualify" a process and/or product for shipment. it's just begged to be repeated and no comments would be needed :-)) Re:My impression of the 1GHz+ market, is that sales are very small at those levels. while small it does not explain why amd shipped 10x (retail) 1GHz parts as compared to intel which leads to my next point re:o keep the ASP's of Willamette high, while dramatically shrinking the size, and cost of CuMine. Doesn't sound like a bad plan to me. not a bad plan. Especially since similar plans worked great for intel up until the point when AMD got their act together. Is intel counting on amd's screw-up or on intel's competitiveness. It seems that in very recent past Intel stopped counting on screw-ups and competitiveness as well since intel had to resort to rambus, proprietary mb, buying off VIA through orders, and few more Re:1 Willamette die per "field", vs. 2 die per field for CuMine. there are no other risks that can lead to lower yields? Regards -Albert