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To: semiconeng who wrote (5491)8/17/2000 7:49:22 PM
From: ScumbriaRead Replies (2) | Respond to of 275872
 
Semi,

Thanks for the C4/Flip Chip description. Every once in a while, someone actually writes something useful on these threads....

Scumbria



To: semiconeng who wrote (5491)8/17/2000 8:28:49 PM
From: GoutamRespond to of 275872
 
SemiconEng,

Thanks. I stand corrected. My rant was based on old technology. I'm aware of the fact that it's FC packaging, but some how in my discussion, the FC fact just escaped my thoughts. Anyway, I still believe most of the heatsink incidents reported are to do with chipping of the package rather than to do with cracking of the die. Again, thanks for the info.

Regards,
Goutama



To: semiconeng who wrote (5491)8/18/2000 1:45:39 AM
From: BilowRead Replies (1) | Respond to of 275872
 
Hi semiconeng; Great post on C4 bump process.

The explosion in cheap pins is largely what has made RDRAM out of date. I suppose that Intel didn't think this would happen way back when they inked the deal with Rambus.

-- Carl


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