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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Ali Chen who wrote (5497)	8/17/2000 8:39:30 PM
From: ptanner	Respond to of 275872

Ali, Re: "Actually, the problem is not to support the head sink evenly, as you say. The chipping happens mostly during installation/re-installation." Thanks for the explanation -- the pads help protect during installation not necessarily static support. Also thanks to others (semiconeng?) for the FCPGA explanation and link. More than I need to know or can appreciate but still interesting to read. "BTW, I guess there must be a documentation picturing the product, and it probably says that the silicon chip sits 0.030" above the substrate surface, ceramic (AMD) or plastic (Intel)." I thought I would look this one up as a real contribution. From AMD's documentation "AMD Athlon Processor PGA Data Sheet" the following heights (relative to top of package): Pads 1.90 mm (max) "Discrete Components" 0.116 mm (min) Chip 0.80 mm (min) to 0.88 mm (max) The full description is over on AMD's site under technical document 23792.pdf (or perhaps a more recent revision as my is "preliminary"). -PT