Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Scumbria who wrote (108454)	8/26/2000 12:35:56 PM
From: semiconeng	Read Replies (1) \| Respond to of 186894

IBM has been using local interconnect for years, with great success. It allows substantial savings in SRAM array and standard cell area. My company also uses local interconnect. ;^)) Scumbria Right, IBM introduced it into manufacturing in 1988. They ought to be able to get it right with 12 years of work: research.ibm.com "Planar BEOL technology has been used in IBM DRAM, bipolar, and CMOS logic programs since its introduction into manufacturing in 1988. HOWEVER: The tight metal pitches needed on multiple wiring levels require near-vertical, zero-overlap via studs. An alternative to forming W studs by means of CMP is to make use of reactive ion etchback; however, its use results in an extremely tight manufacturing process window and a process that is prone to yield and reliability defects. It's great for SRAM, but it's been my experience that it plays hell with the logic circuits. I notice that when you say that your company has been using it for years, you don't say "With great yields". :-) SemiconEng