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To: semiconeng who wrote (108621)8/27/2000 4:53:53 PM
From: THE WATSONYOUTH  Respond to of 186894
 
I never said that "I ran IBM's process flow." I said that I know what it takes to maintain a tight process window on Reactive ION Etching.

So we have established you never ran the IBM local interconnect process. It is clear now from your reply, that you never even read the article you posted the link for, or if you did, you didn't understand it. Yet, you make the following claim about "this kind" of process which you are unable to correctly describe.... I know all about the amount of intensive labor that it takes to maintain the type of dry etch rates that this type of process demands for logic circuits, I lived it for awhile. And believe me, it is neither easy, or cheap, or high yielding..... I would conclude then you must be talking about Intel's version of local interconnect run on Intel equipment by Intel engineers that you describe as neither easy, or cheap, or high yielding Well, I guess that's why Intel chose not to use it. Right?? Hmmmmmmmm. Hey..... did you just violate your NDA???

THE WATSONYOUTH