Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Don Green who wrote (53562)	9/15/2000 11:59:51 PM
From: Don Green	Respond to of 93625

Deal with Toshiba improves microBGA package -- Tessera gets wire-bond technology Sep. 15, 2000 (Electronic Engineering Times - CMP via COMTEX) -- TOKYO - Tessera Inc. will become exclusive licensor of Toshiba Corp.'s wire-bonding process for the microBGA package, according to an agreement reached by the two companies. Toshiba developed the process based on Tessera's microBGA technology. Demand is rapidly increasing for microBGA chip-scale packaging (CSP), which is used for high-speed memories such as Rambus DRAM, SDRAM and double-date-rate SDRAM. Currently, Tessera (San Jose, Calif.) uses a tape-based process, where metal beam leads are employed to connect a chip to soldering balls. The elastomer between the chip and the polyimide needed for conventional beam lead bonding is thicker than the adhesive layer used for wire bonding. Because of its structure, wire bonding enables finer pad pitch and a higher yield rate, according to Toshiba. "The biggest advantage is that [an] existing wire-bonding facility can be used," said a Toshiba spokesman. Under the agreement, Toshiba will transfer to Tessera technical and engineering information to manufacture the wire-bonded BGA chip-scale package. Tessera will then sublicense this technology to others in the industry, including semiconductor manufacturers and assemblers. Used in SDRAM, Rambus Toshiba is already using the wire-bonded BGA package for its main memory products, such as 64-Mbit SDRAM and 128-, 144-, 256- and 288-Mbit Rambus DRAM parts. Those memories go not only into PCs but also into Sony Computer Entertainment's Playstation 2 game console. Tessera intends to add the wire-bonded technology as an alternative to its standard BGA package. Tessera sees the deal as giving it a leg up in packaging processes for next-generation applications that require CSP technology. The agreement also represents the first step in Tessera's strategy to license and standardize packages developed by licensees using Tessera's technology, in this case its microBGA. eet.com