To: elmatador who wrote (8669 ) 9/30/2000 3:43:16 PM From: John Curtis Respond to of 12823 Is this or no future for DSL. ADSL is being slowly killed. We already have the ISDN of the new milenium. ADSL is not going to happen... Comparing xDSL technology to ISDN is apples and oranges. ISDN (popularly known in the industry as I Still Don't Need it) has been around 20 years, and it's struggled for any number of reasons, not the least of which was arriving long before the need for speed became apparent and/or demanded by the populace and business community. This is not to mention such hardware as PC's, etc., hadn't descended the cost curve sufficiently at the time to make them as ubiquitous as they are now. And by the time this need was apparent it had blown right by the slow poke speed of 56Kb. The only aspect of ISDN I see doing well at all these days is PRI. And this is exclusively a business product. BRI? Based on market share alone I'd say that's already dead. And if not, from what I see going on in the frame world I'd say frame is beginning the process of burying ISDN. As for asking the operator to unbundle the copper pair and lease it dry to a CLEC....well....this is already happening. The CLEC orders the copper pair in situations where they haven't "fired up" the building, area, etc., and does what they will with it (this is based on personal experience). Admittedly it's a slow process, but it is occurring. Just as the LEC's are now swiftly (by their normally glacial standards) rolling out xDSL as well. I think if you revisit your xDSL is dead thoughts some five years from now I'll bet you'll find it as accurate a statement as that 'ol classic IBM CEO 1954 comment wherein he predicted an entire worldwide demand for computers being "only a couple hundred machines" (I paraphrase). ;-) As for splitting the infrastructure from the service/application arm....hmmmm....an interesting idea. And just about as likely to happen as me walking on the moon. I don't see the LEC's doing this, nor the Fed's mandating it.....particularly as bundling products and applications over one "pipe" becomes more and more attractive, with all economic advantages this entails. John~