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To: Jim McMannis who wrote (16544)	10/29/2000 2:05:37 PM
From: Paul Engel	Read Replies (1) \| Respond to of 275872

Re: "Just what did Elmer mean by the P4 being "IN-FAB" befor December 23rd? Do these things tape-out IN FAB? Do they go to "IN FAB" after the tape out? " Taping out is done PRIOR to the start fo wafers in fab. Taping out means that the Design and verificiation are complete, the various layers are "fractured" (converted to a mask/reticle-making-compatible language) and the database "tapes" are sent to the reticle making facility (electronic data transfer is actually used these days instead of tapes). The reticle makers fabricate the first few reticles ASAP and send these to the appropriate FAB or reticle inspection location - and wafer starts are begun using these first few layers while the remaining reticles are completed at the mask making shop. The "final" reticles are also printed so that the fab can generate a "dummy" die with the appropriate bond pad/bumps probe locations. These "dummy' wafers are sent to the test groups to test their probe cards for testing the die and the assembly group can test out the packaging. TapeOut--> Reticle generation --> Wafer Fab --> Test Paul