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Technology Stocks : Qualcomm Moderated Thread - please read rules before posting -- Ignore unavailable to you. Want to Upgrade?

To: foundation who wrote (4298)	11/4/2000 2:03:31 PM
From: slacker711	Read Replies (1) \| Respond to of 197009

If you believe in NTT's rollout, it is Yozan, not NEC, that you look to for chipsets. NTT has stated its relationship with Yozan in this regard. I believe that NTT is working with Yozan....but I have seen nothing that states NEC is also working with them. I highly doubt that NTT cares who supplies the W-CDMA chipsets as long as they are rolled-out on time. FWIW....Yozan's roadmap is a month behind Qualcomm's. I believe that they are looking to sample in March with volume production by September. They are currently supplying some sort of mother board that emulates their chipset for handset vendors. Here is some more info. on W-CDMA testing.... Message 14592475 Testing began in earnest in September. In some cases, testing the radio access equipment will have to overlap with construction of the basestations themselves to compress the development times. Since summer, Docomo's handset suppliers have started providing prototype systems. Three terminal types will be available when the service is launched: a basic terminal capable of voice, Web-browsing and linking to a PC; a data terminal that includes a PCMCIA card; and a video terminal with a camera. The terminal manufacturers won't have much room for error; final testing for the terminals is slated for only one month before 3G services are launched. Slacker

To: foundation who wrote (4298)	11/5/2000 4:06:57 PM
From: 100cfm	Read Replies (1) \| Respond to of 197009

Ben did this one get by under our radar screens or did I just miss the discussion of this. Any thoughts? PrairieComm expands chip portfolio to support 3G October 30, 2000 By Dan Meyer SANTA CLARA, Calif.—For a company less than seven years old, PrairieComm Inc. provides a diversified portfolio of integrated chipsets, embedded software and licensed intellectual property for wireless handset manufacturers looking to incorporate TDMA, GSM and CDMA technologies. In addition, PrairieComm offers baseband chipsets that support Bluetooth connectivity, voice-recognition capabilities and third-generation CDMA, TDMA and GSM technology. The latest addition to its product line is the PCI5110, a dual-mode integrated baseband processor supporting the UMTS standard for 3G cellular communications. The PCI5110 incorporates both W-CDMA and GSM technologies, and enables GPRS for high-bandwidth mobile communications, according to PrairieComm. ‘‘PrairieComm is using its experience in TDMA, CDMA and GSM to establish a lead in the implementation of next-generation UMTS,’’ said John Diehl, president and chief executive officer of PrairieComm. ‘‘The PCI5110 reduces cost and speeds time-to-market for handset makers preparing to compete in the global 3G marketplace, especially Europe and Asia.’’ PrairieComm said it is able to meets these needs for handset manufacturers by using a common architectural platform for its chip designs. In addition to being UMTS compatible, the PCI5110 is designed to operate on existing GSM/GPRS infrastructure, providing compatibility with current and future wireless phone. The new chipset is designed to transmits at a maximum data rate of 384 Kilobits per second and supports Turbo Coding for high data transmission. In addition, the chip incorporates a Universal Serial Bus interface capable of transmitting at 12 Megabits per second. Mobile handsets based on the new chipset will be able to support data-intensive multimedia applications, as well as WAP and the Bluetooth specifications for short-range wireless connectivity, the company said. ‘‘Annual growth in mobile terminal shipments during the past several years has been nothing short of extraordinary,’’ said Bryan Prohm, senior analyst for mobile communications with DataQuest. ‘‘Looking forward, the expected proliferation of next-generation data-enabled devices will be equally impressive. The transformation of the mobile terminal into a viable platform for data communications can only be realized if the enabling technologies are in place well beforehand. Hence, that evolution must begin in earnest at the component level.’’ In a separate announcement, PrairieComm Inc. and RF Micro Devices Inc., a provider of proprietary radio-frequency integrated circuits for wireless communications applications, formed a non-exclusive alliance to provide a complete baseband/RF chipset solution for the North American TDMA/EDGE market. While both companies currently offer integrated circuit solutions to the North American TDMA market, together, RF Micro Devices and PrairieComm plan to provide potential customers with a development board capable of speeding time-to-market and reducing design costs for next-generation wireless handsets. The combination baseband/RF solution will use PrairieComm’s PCI3800 integrated baseband processor that supports TDMA/EDGE wireless telephony and includes firmware and software with a protocol stack and complete development platform. PrairieComm said the alliance will also benefit customers with smart partitioning of analog and digital processing blocks, elimination of redundant functions, joint system level requirements analysis and the ability to demonstrate a phone call with a jointly developed demonstration and evaluation platform.