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Technology Stocks : Lam Research (LRCX, NASDAQ): To the Insiders -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (4448)	11/20/2000 10:46:05 PM
From: Proud_Infidel	Read Replies (1) \| Respond to of 5867

TSMC to Speed Up Implementing 0.13-Micron IC Processing Tech November 20, 2000 (TAIPEI) -- To speed up the development of Bluetooth and optical-fiber network applications to feed global market needs, Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) has launched pilot production of a CMOS radio-frequency (RF)/mixed-signal chip in a 0.13-micron version. CMOS refers to complementary metal oxide semiconductor know-how. TSMC's 0.13-micron RF/mixed signal chip technology is expected to go into full production in the fourth quarter of 2001. Until now, its 0.18-micron version processing had been the most advanced foundry technology for making telecom chips. However, to compete with international foundry companies, TSMC has been developing 0.18-micron RF/mixed-signal technology for an embedded Bluetooth chip. Also, United Microelectronics Corp. (UMC) is revving up development of 0.13-micron processing technology, while continuing commercial production with 0.15-micron and 0.18-micron technologies for its major markets. Most telecom chips are processed with 0.35-micron and 0.25-micron technologies. UMC estimates that some suppliers will contract foundry providers to process their chips with 0.13-micron technology around the end of this year or early next year. TSMC is in talks with some integrated device manufacturers (IDMs) that produce chips of their own design, on cooperation in co-developing 0.1-micron technology. The company's 0.1-micron technology is scheduled to come on line in 2002. Related story: TSMC Develops 0.13-Micron RF Test Chip (Commercial Times, Taiwan)