To: brian h who wrote (1305 ) 12/3/2000 11:42:12 PM From: brian h Read Replies (2) | Respond to of 1881 TSMC's Embedded Flash Provides System-On-A Chip Performance and Density TSMC's EmbFlashTM technology is the foundry industry's leading embedded flash technology. This reliable and cost-effective process is used to manufacture a broad range of products found in MCU, DSP, smart card, cellular communications, automotive, CPLD, and many other applications. Combining TSMC's industry-leading logic process and SST's SuperFlashTM split-gate flash cell, EmbFlashTM provides a logic-compatible technology that features high performance logic function and cost-effective flash memory. EmbFlashTM can increase device functionality by integrating SRAM and analog functions on the same chip. EmbFlashTM is currently available in 0.5-µm, 0.35-µm, and 0.25-µm process generations. The 0.18-µm EmbFlashTM process is scheduled for launch in the fourth quarter of 2000. EmbFlashTM features small flash block sizes and low masking steps. The average yields of the matured products in 0.5-µm and 0.35-µm are over 90% in high volume production. Most popular flash blocks are provided, with density from as small as 32Kb to several Mega bits, and data buses 8 bits, 16 bits, and 32 bits. High performance and low power consumption are implemented in the memory design. Designers can choose from an array of flexible sector sizes down to 4 bytes/sector, close to EEPROM capability. TSMC also provides a number of embedded non-volatile memory implementation services including flexible FlashIPTM design, flash testing, FlashROMTM conversion, and turn-key service. FlashIPTM is a complete set of macros that can be designed to specific densities and configurations. TSMC's flash testing services provides customers with an added assurance of design quality and reliability. Designers can also take advantage of TSMC's FlashROMTM service to automatically and cost-effectively convert the flash into ROM without expensive design modification.