SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?


To: Proud_Infidel who wrote (40023)11/27/2000 2:03:11 PM
From: Proud_Infidel  Respond to of 70976
 
Mosel Vitelic to Shift from DRAMs to System ICs
November 27, 2000 (TAIPEI) -- Mosel Vitelic Inc. of Taiwan will shift its business from DRAMs to system LSIs in 5-10 years, said Thomas Chang, vice president in charge of the firm's technology transfer coordination.



Mosel Vitelic generates 75 percent of its sales from DRAMs. However, the company intends to increase output of system LSIs so that they account for 75 percent of sales by 2010.

The manufacturing of system LSIs requires 0.1-micron technology using 300mm wafers. To lay the cornerstone for this switchover, Mosel Vitelic plans to construct two lines for 300mm wafers. One of them is "ProMOS Fab" at Hsinchu, in Taiwan, which will initially start producing DRAMs using a 0.13-micron process in 2002. Later, it will be upgraded to 0.1 micron.

The other is a plant slated for construction in Canada. It will manufacture flash memory chips and flash memory-embedded logic IC chips using a 0.14-micron rule, from 2003. This plant also will downsize the process rule to 0.1-micron by the end of 2004, the company said.

In addition to the construction of these two facilities, Mosel is preparing to outsource the design work now done in-house to firms in the United States.

(Nikkei Microdevices)