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To: Don Green who wrote (61911)11/27/2000 4:56:35 PM
From: 44magnumpower  Read Replies (1) | Respond to of 93625
 
Micron's plans to ship 334 MHz (PC2600) DDR SDRAM modules beginning in the second quarter of next year. The company is already shipping 334 MHz, 374 MHz, and 400 MHz DDR DRAMs to graphics board-makers, and is working on a fine-pitch BGA package for use with such chips on PC2600 memory modules.

Micron is already using the fine-pitch BGA packaging for its most advanced SDRAMs to get higher performance. "With the smaller fine-pitch BGA package size, we can get away from stacking TSOP [thin small-outline package] SDRAM packages in modules to get faster speed and better thermal management," Mailloux said.

He expected a prototype PC2600 module would be finished soon. After testing and qualification, the new highest-speed DDR module would be ready to ship in the second quarter of next year, he added.
Micron's not the only one working on faster memory, however. Thanks to Jochem for sending in this link about Samsung's push to 0.17-micron production for 128 Mbit, 144 Mbit, and 288 Mbit Rambus DRAMs. In addition to shrinking die sizes, the shift in production also allows for higher clock speeds -- up to 30 percent higher, in fact. Such an increase could mean parts as fast as 1.066 GHz.