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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Joe NYC who wrote (21323)	12/1/2000 3:54:54 PM
From: andreas_wonisch	Respond to of 275872

Joe, Re: While I think it is a long shot, I think the semi companies will need to use all the tricks in the book in the future to get more performance out of their chips. Yes, I agree. Just a few years ago you could use a passive heat sink without a fan for your CPU and some years before that you didn't need a heat sink at all. If you compare that to today's massive heat sinks with 80mm fans air cooling alone will probably not be enough to cool future CPUs above three or four GHz down enough. Maybe we will have new ways of cooling (e.g. with water) but the semi companies will also need to find new ways to decrease heat dissipation and to eliminate heat "hotspots". Pure silicon could be one way to achieve that. BTW, I found this link on the Yahoo board (it's from July 1999): semiconductor.net Looks like the rumors are real. Andreas

To: Joe NYC who wrote (21323)	12/1/2000 7:55:43 PM
From: eplace	Respond to of 275872

Jozef, Can another company (bigger wafer producers) do exactly the same thing, cutting Isonics out of the picture. Joe isonics.com In 1995 Isonics signed an option agreement with Yale University for an exclusive license to U.S. Patent 5,144,409 covering the manufacture of semiconductor devices on isotopically pure silicon. In July 1997, Isonics exercised its option by providing the world’s first isotopically pure silicon wafers suitable for semiconductor fabrication. The exclusive license to this key patent provides Isonics the ability to direct the commercial development of isotopically pure silicon, essentially world-wide, since the patent provides a significant barrier to entry to potential competitors. I don't think this stuff is necessarily OT since use of these materials could help AMD immensely. Regards Ed P.