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To: RDM who wrote (21368)	12/2/2000 3:53:50 PM
From: fyodor_	Read Replies (2) \| Respond to of 275872

RDM: However, this 40% savings is not 30 degrees C for a 1 GHZ processor. Regardless of how you do your math, that was exactly their claim. I finally found the reference: California-based Isonics produces an isotopically pure silicon which has much better thermal conductivity than natural silicon, meaning that heat can be removed more effectively. Isonics won't confirm it's working with AMD, stating only that "a major microprocessor manufacturer has modeled isotopically pure silicon wafers and has told us that the peak temperature of their advanced 1GHz microprocessor was reduced by 35 degrees celsius." theregister.co.uk -fyo

To: RDM who wrote (21368)	12/2/2000 4:00:36 PM
From: Mani1	Read Replies (1) \| Respond to of 275872

RDM re <<The thermal drop through the silicon wafer to the package is 60% of conventional silicon at 100 degrees C>> This is like saying voltage drop in resister A is 60% of that in resister B, without knowing anything about the two resisters. You simply can not make general comments like that. The thermal model and specific at the die varies not only on the heat output from the die, but also on the geometry of the die as well as the resistance of the entire thermal circuit all the way up to the fan and sink. Generally speaking, with a CPU dissipating up to 100 watts and with a current two fan & sink assembly, the wafer's bulk conductivity is not a thermal "bottle neck". Meaning a higher thermal conductivity wafer will offer little in that respect. But as the cooling solution become more advanced and die will become thinner, a higher conductivity die will offer more and more. Mani