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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: Mani1 who wrote (21384)	12/2/2000 10:29:52 PM
From: ptanner	Respond to of 275872

Mani, Re: Si-28 You're welcome for the link. The hot spots in the CPU would be transitory depending on what the CPU is doing. Since mine is running RC5 in the background utilization tends to remain at 100% and it runs pretty hot. Especially with the stock heat sink with the thermal tape remove but no grease (the tape was messed up when I pencilled). Better heatsink, additional case fan, and arctic silver are in the mail. Also a digital thermal probe to play with. WRT Si-28. Thermally (total processor hear) the peak spots may not be a big deal since they are likely transitory but this could be important for CPU speed binning. Wouldn't it be likely that the testing process would be designed to maximize the "stress" on the CPU in order to determine its potential to reliably operate at the target speed? The change in thermal characteristics could be as important as minor changes in layout to remove the speed limiting components. A processor that won't run at the highest speed bin doesn't have a flaw (incorrect) but simply has a limitation that causes errors when operating at that speed and modified thermal characteristics could be a factor. However, it seems I have also read that the speed testing process is very rapid but have forgotten all the details so the thermal conductivity benefit could be completely irrelevant to speed binning but still relevant to life-cycle. I just finished reading a long thread on Aces that includes opinions on the enhanced thermal conductivity (particularly isometric), reduce thermal generation (lower, more uniform electrical conductance? this confused me as I am not a semi engineer), and just for some flavor many posts on black holes and collapsars. Nothing really stuck with me but it was entertaining. aceshardware.com I think AMD is still doing too much downbinning but needs Palomino to be able to shift the top speeds higher to maintain a range for Durons. May also need more L2 cache to maintain scaling. I will report on my OC (presently 600@750 but 59C, was 53C with old tape) and thermal management with the new hardware. Even as the system arrived it was warmer than I wanted. I plan to play with a lot of FSB & CPU multipliers. Not sure what benchmarking software I will use. Probably just Sandra and RC5. If it turns out real interesting and/or long I will probably try to publish somewhere else rather than in an SI post since. -PT