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To: Mani1 who wrote (21430)	12/4/2000 7:53:47 AM
From: Bill Jackson	Read Replies (2) \| Respond to of 275872

Mani, As the heat sink gets flatter and the heat transfer material better and thinner the relatively large interstitial losses shrink enormously, possibly enough that the Si becomes the limiting factor? In that case 30% is quite reachable!! Out of curiosity what are the best heat transfer pastes? Bill

To: Mani1 who wrote (21430)	12/4/2000 10:07:39 PM
From: fyodor_	Read Replies (1) \| Respond to of 275872

Mani: I am sure the 30% is sheer exaggeration. I base this opinion on analysis of numerous thermal models over the past several years. You sound like you know your stuff here and I certainly appreciate you sharing your insights. Do you consider it possible that the 35degC could be attained under "special" circumstances? By special I mean things like improved thermal paste, super copper heat sink, lots of pressure, extra-high rpm fan, ... (but not kryotech stuff!). Or are they COMPLETELY bs'ing? I guess I could ask it in another way... would you invest in Isonics based on the information available at this time? -fyo