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To: pgerassi who wrote (21453)	12/4/2000 1:42:10 PM
From: Daniel Schuh	Read Replies (1) \| Respond to of 275872

Pete, you can view figures for thermal conductivity of Si at efunda.com , though the unit conversion from W/cm-C to W/m-K is obscure. Looking this up, I found a couple other references that might be of interest. ednmag.com talks about detailed thermal modeling of BGA packages, at a somewhat lower power level than a 50W processor though. In a general discussion on multichip modules, I found this little tidbit of interest. F1.3.3 Thermal properties For some applications, the thermal properties are important. The first way to improve the thermal properties is to choose a substrate with a good thermal conductivity, like certain ceramic materials (beryllium oxide or silicon nitride), silicon or metal based substrates. If the substrate itself is not able to cope with the power, alternative heat paths have to be found. This can be to attach the chips to some type of heat sinks, and use natural or forced convection priciples to bring the die-temperature to the specified level. extra.ivf.se I still got a feeling that the substrate is what was being talked about in theregister.co.uk. But given the author of that article, I wouldn't try to read too much into it at any rate. Cheers, Dan.