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To: Mani1 who wrote (21508)12/5/2000 12:12:41 AM
From: eplaceRead Replies (1) | Respond to of 275872
 
Mani...I strongly think that at best the new wafer is few years away, so I would do a wait and see.

Mani

Mani, why do you say that? From what I have been reading about si28, it is interchangeable with silicon now being used. Maybe you can enlighten us here.

Ed P.



To: Mani1 who wrote (21508)12/5/2000 8:23:31 AM
From: Bill JacksonRespond to of 275872
 
Mani, I am not so sure they cannot do it. After all when you reduce the thermal 'resistor' that is the substrate by 40% and then you reduce the interface'resistance' by two methods(thinner paste and better paste) and then use a copper spreader you will have completely changed the temperature profile. Same heat of course, but a lower resistance pathway. That means the hotspots will be cooler as will the entire chip.

Bill


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