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To: Dealer who wrote (22630)	12/7/2000 11:42:43 AM
From: Dealer	Respond to of 65232

QCOM--RFMD,QCOM news: RF Micro Devices Announces Milestone Achievement in Alliance With QUALCOMMRFMD and QUALCOMM Collaborate to Design Next Generation of Power Amplifier Modules GREENSBORO, N.C., Dec 7, 2000 (BUSINESS WIRE) -- RF Micro Devices, Inc. (Nasdaq: RFMD chart, msgs), a leading provider of proprietary radio frequency integrated circuits (RFICs) for wireless communications applications, announced today the achievement of a significant strategic milestone in its alliance with QUALCOMM CDMA Technologies (QCT), a division of QUALCOMM Incorporated, (Nasdaq: QCOM chart, msgs). The PA3300(TM) series of power amplifier modules, announced on December 5, 2000 by QUALCOMM, is the second product developed by QCT and RF Micro Devices, and represents the achievement of a milestone in the product development alliance announced by RFMD and QCT in February 2000. The result of a joint effort by QCT and RF Micro Devices, the PA3300 is manufactured by RFMD using its advanced Gallium Arsenide Heterojunction Bipolar Transistor (GaAs HBT) process. "The PA3300 series of power amplifier modules continues QCT's commitment to develop CDMA RF products that enable manufacturers to develop more sophisticated yet cost-effective wireless handsets," said Johan Lodenius, senior vice president of marketing and product management for QUALCOMM CDMA Technologies. "Our ongoing partnership with RFMD provides state-of-the-art solutions that allow handset manufacturers to offer their customers longer talk-time capability in smaller form factors as well as a reduction of handset production time." "The PA3300 - QCT's second generation of power amplifier modules - is the result of a true collaboration between QCT and RF Micro Devices," said Jerry Neal, RFMD's executive vice president of sales, marketing and strategic development. "By teaming together from the concept stage through development, we were able to create a highly integrated and innovative power amplifier module optimized to support and complement QUALCOMM's total CDMA solution. "This development is particularly significant because it follows up on the success of the recently introduced PA3100(TM) and provides further evidence of the strength of our relationship with QUALCOMM," Neal added. "We look forward to continued collaboration with QUALCOMM in order to offer the best performing and most cost-effective power amplifiers for the CDMA market." About QUALCOMM CDMA Technologies