Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Novellus -- Ignore unavailable to you. Want to Upgrade?

To: Alan Gallaspy who wrote (3106)	12/8/2000 1:42:16 AM
From: Alan Gallaspy	Read Replies (2) \| Respond to of 3813

Has this been posted about Applied's latest attempt to enter the Cu market? I guess they may get some market share. electronicnews.com Motorola Demos Applied Materials’ 300mm Copper Tool Set Electronic News Dec 06, 2000 --- Applied Materials Inc. today said that Motorola Semiconductor Products Sector has successfully demonstrated its 300mm copper equipment set, which consists of the Endura Electra Cu Barrier/Seed 300 system, Electra Cu iECP 300 (integrated electrochemical plating) system and Reflexion CMP (chemical mechanical polishing) system. Motorola has been working with the Santa Clara, Calif., company to demonstrate the 300mm tool set for multilevel copper interconnects. “This work has shown remarkable electrical performance on wafers processed on our copper interconnects at the same or better performance levels as compared to interconnect results on 200mm,” said Doug Keenan of Motorola’s DigitalDNA Laboratories, in a statement. Applied’s Endura Electra Cu Barrier/Seed technology, which is used by most chipmakers who manufacture copper devices, deposits tantalum and tantalum nitride barrier films and copper seed layers. The Electra Cu iECP technology, introduced in 1999, offers advanced electroplating technology integrated with bevel clean and post-anneal processing steps. Motorola said the demonstration in part of its ongoing plans to evaluate 300mm equipment. The company recently completed a joint venture with Infineon, which it began in 1998, that resulted in the first sellable DRAM devices made with 300mm equipment. Motorola also is working with its other partners to develop tool sets for 300mm wafer manufacturing.