TSMC and Conexant Announce Long-Term Technology License and Wafer Supply
Agreement Program to Expand Access to Specialty Radio Frequency Process Technologies for
the Communications Market
NEWPORT BEACH, Calif. & HSIN-CHU, Taiwan, Jan 30, 2001 (BUSINESS WIRE) -- Conexant Systems, Inc. (Nasdaq: CNXT chart, msgs) and Taiwan
Semiconductor Manufacturing Company (TAIEX:2330) (NYSE: TSM chart, msgs) Tuesday announced that the two companies have entered into a long-term
semiconductor cross- licensing wafer supply and technology agreement.
Under this agreement, TSMC will license advanced specialty radio frequency (RF) process technology intellectual property (IP) from Conexant to be used for
bipolar and silicon germanium bipolar complementary metal oxide semiconductor (SiGe BiCMOS) applications, and will supply foundry capacity for these
technologies to Conexant.
TSMC will take advantage of the licensed technology to more quickly bring its own high-performance foundry processes to the marketplace, particularly to satisfy
requirements in the growing networking and wireless communications markets.
"Conexant is a leader in advanced specialty process technologies for the communications market," said Dr. F.C. Tseng, president of TSMC. "We believe this
agreement will allow us to accelerate delivery of these technologies to the broad foundry market."
"TSMC is the foundry industry leader in both total volume output and breadth of technology," said Dwight W. Decker, chairman and CEO of Conexant. "This
agreement strengthens a vital relationship with a world-class supplier, provides a second source for Conexant products and leverages our investments and leadership
position in advanced specialty RF process technologies. We are delighted with this agreement and look forward to working closely with TSMC for many years to
come."
Initial production of the first-generation specialty technology at TSMC is expected in the second half of 2001, with further advanced- generation technologies
coming online in the following quarters.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology, library and IP options and other leading-edge
foundry services. TSMC operates two six-inch wafer fabs and six eight-inch wafer fabs. The company also has substantial capacity commitments at two joint
ventures fabs (Vanguard and SSMC) and WaferTech.
In year 2000, TSMC produced the foundry industry's first 300mm customer wafers and began constructing three dedicated 300mm fabs. Fabrication processes
offered by TSMC include CMOS logic, mixed-mode/RF, volatile and non-volatile memory and BiCMOS. TSMC's corporate headquarters are in Hsin-Chu. More
information about TSMC is available through the World Wide Web at www.tsmc.com.
About Conexant Systems, Inc.
With revenues of $2.1 billion in fiscal 2000, Conexant is the world's largest independent company focused exclusively on providing semiconductor solutions for
communications electronics. With more than 30 years of experience in developing communications technology, the company draws upon its expertise in mixed-signal
processing to deliver integrated systems and semiconductor products for a broad range of communications applications.
These products facilitate communications worldwide through wireline voice and data communications networks, cordless and cellular wireless telephony systems,
personal imaging devices and equipment, and emerging cable and wireless broadband communications networks.
The company organizes its activities into two business areas: Internet infrastructure, which consists of the Network Access products and personal networking,
comprised of Digital Infotainment, Personal Imaging, Wireless Communications and Personal Computing products. Conexant is a member of the S&P 500 and
Nasdaq-100 Indices. For more information, visit Conexant at www.conexant.com.
Safe Harbor Statement
This news release contains statements relating to future results of Conexant (including certain projections and business trends) that are "forward-looking statements"
as defined in the Private Securities Litigation Reform Act of 1995. Actual results may differ materially from those projected as a result of certain risks and
uncertainties. These risks and uncertainties include, but are not limited to: maintaining a consistent and reliable source of energy; global economic and market
conditions, such as the cyclical nature of the semiconductor industry and the markets addressed by the company's and its customers' products; demand for and
market acceptance of new and existing products; successful development of new products; the timing of new product introductions; the availability and extent of
utilization of manufacturing capacity; pricing pressures and other competitive factors; changes in product mix; fluctuations in manufacturing yields; product
obsolescence; the ability to develop and implement new technologies and to obtain protection for the related intellectual property; the successful separation of the
company's Internet infrastructure and personal networking businesses; the ability to attract and retain qualified personnel; labor relations of the company, its
customers and suppliers; and the uncertainties of litigation, as well as other risks and uncertainties, including, but not limited to, those detailed from time to time in the
company's Securities and Exchange Commission filings. These forward-looking statements are made only as of the date hereof, and the company undertakes no
obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise. Other brands and names contained
in this release are the property of their respective owners.
Contact:
Conexant Systems, Inc., Newport Beach
Lisa Briggs, 949/483-1148 (media relations)
Mike Cortright, 949/483-6773 (investor relations)
or
TSMC
Dan Holden, 408/382-7921 (North America)
J.H. Tzeng, +886-3-5780221, x3338 (Taiwan) |
