Sequence Licenses Its Inductance Extraction Tool to QUALCOMM for Wireless
Chip Design
SANTA CLARA, Calif., Feb 5, 2001 (BUSINESS WIRE) -- Sequence Design, Inc., the
specialist in power, timing and signal integrity optimization for system-on-chip
(SOC) integrated circuits, today announced that QUALCOMM CDMA Technologies, a
division of QUALCOMM Incorporated (Nasdaq:QCOM), will utilize the company's
Columbus-RF(TM) RLC interconnect modeler in the design of radio-frequency (RF)
integrated circuits for digital wireless applications.
After extensive evaluation, QUALCOMM chose to license the Sequence tool based on
its ability to accurately model the parasitic inductance of wires on a chip and
the ease of use of this software within the Cadence Analog Artist(TM) design
tools.
At Gigahertz frequencies, the inductive behavior of a chip's interconnect is a
critical consideration in determining whether or not the chip will meet its
performance specifications. Without accurate advance knowledge of this behavior,
design teams may fabricate RF chips that will not work correctly.
"Columbus-RF is the first tool we've seen that can accurately predict parasitic
wire inductance," said Jim Tran, director of product management for QUALCOMM
CDMA Technologies. "This capability translates directly to faster product
development."
"QUALCOMM is at the absolute forefront of digital wireless design today," said
Eric Filseth, vice president, product marketing for Sequence. "We're extremely
pleased that QUALCOMM has chosen our solution."
About Columbus-RF(TM)
Columbus-RF(TM) is a state-of-the-art interconnect modeling tool used during the
design of RF and other high-frequency analog integrated circuits, where layout
parasitics are an important contributor to chip performance. Columbus-RF
accurately models not only the resistance and capacitance of a chip's
interconnect, but also leverages an advanced, patent-pending algorithm to
calculate its inductance -- a critical property at Gigahertz frequencies.
Columbus-RF is seamlessly integrated into the popular Analog Artist(TM) and
Diva(TM) design flow from Cadence Design Systems (NYSE:CDN), enabling
push-button post-layout simulation of demanding RF, analog and mixed-signal
designs.
Columbus-RF is a component of the Columbus Interconnect Modeling Suite, which
provides design teams with a single interconnect modeling platform for entire
"system-on-chip" designs which include analog and mixed-signal blocks.
Sequence's patented Exact Topological Decomposition algorithm not only enables
it to achieve the industry's highest interconnect modeling accuracy, but also
scales efficiently in multiprocessing environments such as compute farms; this
makes Columbus an ideal choice for very large designs.
Columbus-RF leverages technology libraries based on the Silicon Integration
Initiative (Si2) SIPP standard, an industry format supported by leading
foundries such as TSMC, UMC, Chartered Semiconductor and others.
About QUALCOMM
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and
delivering innovative digital wireless communications products and services
based on the Company's Code Division Multiple Access (CDMA) digital technology.
The Company's business areas include CDMA integrated circuits and system
software; technology licensing; Eudora(R) email software for Windows and
Macintosh(R) computing platforms; digital cinema systems; and satellite-based
systems including portions of the Globalstar(TM) system and wireless fleet
management systems, OmniTRACS(R) and OmniExpress(TM). QUALCOMM owns patents that
are essential to all of the CDMA wireless telecommunications standards that have
been adopted or proposed for adoption by standards-setting bodies worldwide.
QUALCOMM has licensed its essential CDMA patent portfolio to more than 90
telecommunications equipment manufacturers worldwide. Headquartered in San
Diego, QUALCOMM is included in the S&P 500 Index and is a 2000 FORTUNE 500(R)
company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.
About Sequence
Sequence Design, Inc. is the specialist in timing, power and signal integrity
optimization for design closure of system-on-chip integrated circuits.
Sequence's chip design software and services enable engineering teams to develop
superior products quickly, in order to achieve competitive advantage in
high-growth technology markets. Customers include Broadcom, Ericsson, Fujitsu,
LSI Logic, NEC, Nokia, Nortel Networks, MMC Networks, Sony, Sun Microsystems,
Texas Instruments, Toshiba and Vitesse Semiconductor.
Sequence supports worldwide development and field service operations. The
company was formed through the merger of Sente, Inc. and Frequency Technology.
Sequence is privately held; investors include Alpine Technology Ventures, Atlas
Venture, Intel, IVP, LSI Logic, Menlo Ventures, Sigma Partners, Skywood
Ventures, Sofinnova, and Sumitomo Corporation.
Sequence is a member of Cadence Design Systems' Connections(TM) and Mentor
Graphics' (Nasdaq:MENT) Open Door(TM) partnership programs. Please visit our web
site at www.sequencedesign.com.
Note to Editors: All trademarks mentioned herein are the property of their
respective owners.
CONTACT: Sequence Design Inc., Santa Clara
Eric Filseth, 408/961-2365
efilseth@sequencedesign.com
or
VitalCom Marketing & Public Relations
Ann Steffora, 650/637-8212 ext. 207
ann@vitalcompr.com
or
QUALCOMM CDMA Technologies
Anita Hix, 858/658-5879
ahix@qualcomm.com
URL: businesswire.com
Today's News On The Net - Business Wire's full file on the Internet
with Hyperlinks to your home page.
Copyright (C) 2001 Business Wire. All rights reserved. |
