the infrastructure for 2.5 & 3g wireless will be built because the devices are coming..
Monday February 19, 2:00 am Eastern Time
Press Release
SOURCE: Texas Instruments Incorporated Semiconductor Group
TI Delivers First DSP-Based OMAP(TM)
Application Processor Revolutionizing Performance and Power Efficiency
for 2.5 and 3G Wireless
TI's DSP/BIOS(TM) Bridge Enables the Highest Performance and as Little as 1/4 the Power,
While Providing Software Developers Easy Access To Real-Time DSP Functionality
DALLAS, Feb. 19 /PRNewswire/ -- The industry's first processor to deliver the performance and power efficiency required
for the emerging 2.5 and 3G wireless applications was made available today by Texas Instruments Incorporated (NYSE: TXN
- news; TI). Based on TI's open and programmable DSP-based OMAP(TM) architecture, the new processor will allow the
next generation of mobile Internet access devices to run real-time, broadband-enabled wireless applications such as video
conferencing, streaming video, Internet audio, mobile commerce, location-based services and firewall security, with the longest
battery life on the market. See www.ti.com/sc/omap.
``Texas Instruments DSP-based OMAP applications processor makes multimedia- rich 2.5G and 3G wireless applications a
reality by providing a unique combination of both performance and power efficiency,'' said Will Strauss, president of analyst
firm Forward Concepts. ``TI's dual-core architecture allows original equipment manufacturers (OEMs) and applications
developers to easily deliver new real-time applications that will greatly enhance the utility of future cell phones and wireless
PDAs.''
TI's OMAP(TM) application processor is a dual-core architecture, based on TI's code compatible, ultra-low power
TMS320C55x(TM) DSP core and a TI- enhanced ARM microcontroller. This processor, leveraging TI's leading DSP
technology, enables up to four times the system performance at a given frequency and as little as one-fourth the power of
competing RISC solutions.
``The importance of power efficiency and high performance are set to increase in future mobile phones, and OMAP is well
positioned to meet these demands,'' said Katsumi Ihara, President, Sony's Personal IT Network Company. ``By blending
OMAP and our consumer electronics strengths, I am sure Sony can deliver unique and attractive next-generation mobile
phones in a timely manner.''
Featuring TI's DSP/BIOS(TM) Bridge technology, the OMAP processor partitions real-time and non-real-time software code
between the DSP/RISC architecture to deliver optimal system performance and power efficiency. Real-time, multimedia rich
applications such as video conferencing, streaming video, Internet audio, mobile commerce, location-based services and
firewall security applications take advantage of the OMAP DSP/BIOS Bridge and TI's DSP technology to significantly
enhance application quality and battery life. In addition to the DSP/BIOS Bridge, OMAP processor supports such features as
LCD Control/Frame Buffer for 16 bit 1/4' VGA Display, USB Client & Host Control, MMC-SD Support, Bluetooth
interface, 3.0v/1.8v Dual Voltage I/O support, Magic Gates(TM), Memory Stick(TM), USB, uWire, camera, and enhanced
audio CODEC support.
``The next generation of 2.5 and 3G wireless handsets will bring consumers a wealth of real-time information, available
anytime, anywhere. As new applications emerge to take advantage of this broadband access with multimedia functionality, TI's
OMAP processor delivers the performance and power efficiency that manufacturers require for next generation real-time
communications-based appliances,'' said Gilles Delfassy, Senior Vice President, TI Worldwide Wireless Communications.
``With the introduction and availability of TI's first OMAP standard processor, TI delivers the industry's most advanced
architecture that supports 2.5 and 3G handsets, as well as the emerging spectrum of mobile broadband communications-based
technologies including personal digital assistants (PDA), Internet-enabled web pads, digital still cameras and Internet audio
players.''
TI DSP/BIOS Bridge Provides Developers with Easy Access to Advanced DSP Functionality
Architected to deliver unparalleled system performance without adding unnecessary software programming complexity, the
OMAP processor's DSP Bridge not only delivers enhanced performance and power efficiency, but provides wireless
application developers with easy access to the performance of TI's programmable DSP technology. Using TI's leading
integrated development environment (IDE), Code Composer Studio, application developers will leverage standardized
application programmer's interface (API) to easily access and control the DSP runtime environment. Code Composer Studio is
part of TI's award winning eXpressDSP(TM) Real-Time Software Technology that is designed to slash DSP development and
integration time by up to 50%. This dual-core DSP/RISC architecture running with the DSP/BIOS Bridge allows software
developers to route real-time processing intensive functions to the DSP, where they will run asynchronously with no load on the
RISC kernel scheduling.
OMAP Processor Safeguards 2G Wireless Software Investment
TI's programmable DSP-based OMAP processor is software code-compatible with TI's TMS320C54x(TM) DSP core, used
in more than 60 percent of today's digital wireless handsets. Seamless compatibility with existing as well as future TI
DSP-based architectures allows for OEMs and application developers to focus innovative energies into developing next
generation equipment and applications, without sacrificing development hours of existing software code.
The OMAP processor will offer support from more than 400 DSP third party vendors and software application developers,
slashing development costs and accelerating the process of reaching markets with feature-rich, highly differentiated products.
Once an application is developed for the OMAP processor using the standardized API, it will be compatible with future end
equipments based on the OMAP architecture, maximizing reuse.
Currently, Symbian's EPOC operating system, Microsoft Window's CE operating systems, Sun Microsystems' Java 2 Micro
Edition platform are supported on the OMAP Processor. OMAP also supports multiple DSP operating systems, including
DSP/BIOS(TM) and OSE(TM). Being wireless standard independent, the OMAP processor is compatible with all major 2,
2.5 and 3G wireless communications protocols.
Growing Support of TI OMAP Architecture
The OMAP architecture is fast becoming a de facto standard for 2.5 and 3G wireless devices. Today, Nokia, Ericsson, Sony,
Handspring, Symbian, Microsoft and Sun Microsystems have publicly endorsed TI's OMAP architecture.
Availability
TI's began shipping OMAP processor prototypes in 4Q, 2000, and is shipping samples today. The first OMAP application
processor is scheduled to be available in volume production quantities in 3Q, 2001. |
