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To: Win Smith who wrote (34666)4/3/2001 10:09:08 AM
From: semiconengRespond to of 275872
 
intel.com;

"As previously announced, Intel plans to begin production of its 130 nm process on 300 mm wafers in 2002, about a year after production begins on 200 mm wafers. Chip fabrication cost on 300 mm wafers will be at least 30 percent lower than that on 200 mm wafers."

intel.com

"Splinter continued, "Intel plans to bring this fab on line in record time to meet our customers' needs. It will initially begin production using Intel's 0.13-micron process technology with copper metallization on 200 mm wafers in 2001 and transition into the production of 300 mm wafers." A micron is approximately 1/100th the width of a typical human hair.