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Technology Stocks : Rambus (RMBS) - Eagle or Penguin -- Ignore unavailable to you. Want to Upgrade?

To: Don Green who wrote (69560)	4/3/2001 11:30:48 AM
From: Don Green	Respond to of 93625

Rambus Validates Hynix Semicon Chip Dow Jones Newswires SEOUL -- Hynix Semiconductor (Q.HEL) received validation for a chip from U.S. chipmaker Rambus Inc. (RMBS), the Korea Herald reported Monday. The Rambus dynamic random access memory, or RDRAM, chip has 288 megabytes and can transmit data at speeds up to 1.6 gigabytes. The RDRAM will be made in Cheongju, Korea, according to the Herald. Rambus validation tests ensure components and modules fully comply with Rambus specifications. Newspaper Web site: www.koreaherald.com -By Seoul Bureau, Dow Jones Newswires

To: Don Green who wrote (69560)	4/3/2001 12:03:59 PM
From: Dave B	Respond to of 93625

Don, FWIW, from the HCD web site: Our Mission High Connection Density (HCD), Inc. is a supplier of high performance memory modules and a provider of design and manufacturing resources for high-frequency memory modules, circuit boards and stacked module systems. HCD's innovations, products and services help to accelerate the implementation of high-speed device technologies such as Rambus, DDR and embedded processor systems, into PC, server, Internet infrastructure, data storage and telecommunications markets worldwide. Memory Technology and Advanced Products HCD's high-density packages with leading-edge electrical and thermal solutions are designed for applications such as high-density memory modules and advanced stacked modules. The broad range of HCD's standard and custom products provides not only an additional source for current generation DDR and 128/144Mb-based Rambus RIMMs, but in addition provides a good source for next-generation products such as 256/288Mb-based Rambus RIMMs and proprietary low-profile, flexible footprint memory modules, in addition to SO-RIMMs for space-restricted applications. In addition to a full line of standard Rambus memory modules, HCD offers the NexMod, a family of products offering advanced stacked module solutions. NexMod marries HCD's module technology with standard packaging schemes and various package and board interconnect technologies to create a unique product line. Our Leadership Building on strong technology and financial backing, HCD is lead by a core team of highly experienced industry specialists in the areas of electronic packaging design and simulation, high-speed systems and high-volume manufacturing and test. Dr. Charles Steidel, Chief Executive Officer, oversees HCD's executive management team. Dr. Steidel brings over 30 years experience in electronic packaging to HCD's organization. Before joining HCD, Dr. Steidel was director of packaging at Intel from 1983-1995. From 1995 to 1997 he was Director of Business Development at Kulicke and Soffa Industries Inc. (K&S), an assembly equipment supplier. He was instrumental in establishing Flip Chip Technologies, a joint venture of K&S and Delco Electronics. Dr. Steidel has authored numerous papers and holds several patents in the packaging area. He received a B.Met. Engineering as well as M.Sc. and Ph.D. degrees in Material Science from Cornell University. Jeff Fenice, President of High Connection Density's Interconnect Business Group, is responsible for an Intellectual Property business model, which brings high density, high frequency and high integrity interconnect to the high performance electronics market place. Jeff joined High Connection Density in mid-2000. He obtained an engineering degree in Electronics (1970) from Rennes University, in France and joined Schlumberger in 1980 as Application Manager for IC testing. By 1986, he was promoted to European Marketing Director for ATE (Automated Test Equipment) products and in 1994 was transferred to Asia, to create the Field Marketing support in the region. In 1998, he was given the additional responsibility to develop Schlumberger Advanced Business and Engineering Resources business in Asia. Ralph Kaplan, President of HCD's Module Business Group is responsible for all activities of the Module Business Group. Mr. Kaplan has over 30 years of experience in the electronics industry. He has held positions of increasing responsibility with companies such as Texas Instruments, Signetics and Samsung Electronics. He has experience in sales, marketing, product development and corporate management. In 1998 and 1999 Mr. Kaplan started a new enterprise for Samsung Electronics to bring the Alpha processor to market. He successfully took the company to greater than 100 million revenue. Dr. Dirk Brown, Executive Vice President of HCD, is responsible for worldwide operations. He earned his Ph.D. in Materials Science from Cornell University and has an M.B.A. with a concentration on technology from SJSU. Prior to joining HCD, Dr. Brown managed advanced R&D programs at AMD (Sunnyvale). He has participated as an industry mentor with the Semiconductor Research Corporation (SRC) and is currently a member of the Joint Electron Device Engineering Council (JEDEC). Dr. Brown has published extensively and holds numerous patents in the areas of semiconductors and printed circuit technologies. Our History High Connection Density (HCD), Inc. was incorporated in July of 1997 to address performance limitations in high-density, high-frequency electronics. HCD was founded by Dr. Che-Yu Li who's 30 years of experience in electronic packaging have led him to positions as Director of the Electronic Packaging Program and Chairman of Materials Science and Engineering at Cornell University. Driven by inputs from Intel, IBM and other leading-edge technology companies, HCD began initial development work performed in conjunction with Cornell University's Electronic Packaging Program and industry partners. In Q2 of 1999, the first HCD product requirements were jointly defined with leading computer and data communications OEMs. The result is HCD's commitment to Rambus and DDR based products, and developing the next generation of these product lines. HCD's RIMM products range from 64MB to 1GB modules and extend to the use of the NexModTM stacking technique to address unique form factor requirements. Alliances with manufacturing entities worldwide and the relocation of the company headquarters to Sunnyvale, California in 2000 have positioned HCD for strategic growth. Implementation of worldwide sales and distribution channels as well as continued high volume sales in Asia signifies the expanding market for high performance modular systems and HCD's commitment to being on the leading edge of that technology. Dave