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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Gottfried who wrote (45378)	4/11/2001 10:16:33 PM
From: Shoibal Datta	Read Replies (1) \| Respond to of 70976

Lam looking for orders to be up for the June Q G, or anyone who heard the call, did Bagley expand on orders being up for the June quarter? I am looking at a Bloomberg report that quotes him as saying ""It's beyond my ability to fathom that the bottom is deeper than where we are right now,'' Bagley said." While certainly reassuring, this seems more like touchy-feely optimism (a la JJ/SSB) rather than conviction. It is going to be really interesting to see the outcome of the building JJ/Niles contest. -SD

To: Gottfried who wrote (45378)	4/12/2001 9:22:36 AM
From: Proud_Infidel	Respond to of 70976

UMC, Infineon delay start of 300-mm fab in Singapore, but break ground for plant Semiconductor Business News (04/12/01 09:03 a.m. EST) SINGAPORE--During a groundbreaking ceremony here for a new 300-mm joint-venture fab, United Microelectronics Corp. today indicated that it has pushed back the startup of production in the $3.6 billion facility to 2003. The 300-mm wafer fab--a joint venture between Taiwan's UMC and Infineon Technologies AG of Munich--was originally scheduled to start production in the third quarter of 2002, when the partnership was announced late last year (see Dec. 14 story). A severe slowdown in the chip industry has caused a number of fab projects--in particularly 300-mm (12-inch) wafer plants to be delayed. UMC and Infineon still plan a total investment of $3.6 billion in the 300-mm fab, which will be brought into production in two phases. When fully equipped, the plant is expected to reach a capacity of 40,000 wafers per month. The wafer-processing facility will be run by a new joint-venture company, called UMCi Pte Ltd. UMC holds a majority interest in the venture. Infineon and Singapore's Economic Development Board Investments Pte Ltd (EDBI) are minority shareholders in the new company. The facility will focus on large die-size system-on-chip designs, using UMC's 0.13- and 0.10-micron copper/low-k process technology. UMC will use the Singapore fab to serve its silicon foundry customers, while Infineon expects to produce SoC chips for wireline and wireless communications applications in the plant, said Loh Kin Wah, president of Infineon Technologies Asia Pacific Pte Ltd.