SI
SI
discoversearch

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor.  We ask that you disable ad blocking while on Silicon Investor in the best interests of our community.  If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.
Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?


To: Dan3 who wrote (35734)4/14/2001 8:47:44 PM
From: ted burtonRespond to of 275872
 
The article was wrong - plain & simple. The author doesn't understand the subject matter. He is way off base, and does not have any real data.

The published TDP represents the only reasonable design point. The only changes you will notice if you design to a higher number, are more weight, and more cost. You won't get a perceptible improvement in ISPEC, FSPEC, circuit simulation, photoshop, MPEG encoding, or any other real world app I know of.

As for the fuzzed up heatsink issue. You are correct that if the heatsink fills up with lint, or falls off, or the fan fails, the CPU will start to throttle the highest power apps. The alternative, however, is the blue screen of death. Most reasonable people would take the graceful slowdown over a machine crash.

I'll likely not be back to this thread for a very long time. Sorry I don't have more time to explain things, but I've got real work to do.

-Ted Burton
P.S. I am an Intel employee, but I do not speak for Intel.