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To: Dan3 who wrote (132382)4/15/2001 1:55:41 AM
From: whortso  Read Replies (1) | Respond to of 186894
 
"Intel is hoping to bring its first smidgen of such capacity on line real-soon-now. They don't know when they can begin to hope for SOI. Intel is two years behind AMD."

I was told by an Intel process engineer about 2 years ago that Intel had an SOI process. Public statements from Intel claim they see no cost effective advantage in going to SOI. I think you're pretty out of touch.

-Whortso



To: Dan3 who wrote (132382)4/15/2001 2:10:28 AM
From: Paul Engel  Respond to of 186894
 
Blow Hard Dan - Re: "AMD started putting into place copper FAB technology with pod wafer handling equipment two years ago. "

It was almost THREE years ago:

Friday July 17 1:39 PM ET

AMD, Motorola to announce patent cross-licensing deal
PC Week

By Lisa DiCarlo, ZDNet

Advanced Micro Devices Inc. and Motorola Inc. are hooking up to get ahead in the chip market.

The two will announce a patent cross-licensing deal on Monday that, among other things, gives AMD access to Motorola's copper manufacturing technology and gives Motorola rights to AMD's embedded flash memory and networking products.

The copper portion of the deal could give AMD the technology to more effectively compete against Intel Corp. in terms of performance.

Copper is a more efficient conductor of electricity than aluminum, which is used in chips today. Copper-based chips are expected to be smaller, more powerful and potentially cheaper than today's chips.

AMD is expected to have a copper-based microprocessor commercially available next year.

The Sunnyvale, Calif., company will also get access to Motorola's HiPerMos (high performance CMOS) technology, which AMD will use to add capability to its core logic products.

For its part, Motorola needs AMD's embedded networking and flash memory technology to build system-on-a-chip products for Windows CE devices.

Sources close to Motorola said the Schaumburg, Ill., company chose to use existing embedded technology rather than design its own because of time-to-market issues.

The companies will make the announcement at AMD's headquarters.

See Also:
Get help for your computer problems at the Help! Channel
Read hot news at ZDNN
Work from home? Get good advice from the Small Business Advisor



To: Dan3 who wrote (132382)4/15/2001 2:16:49 AM
From: Paul Engel  Read Replies (1) | Respond to of 186894
 
Blow Hard Dan - re: "Intel is two years behind AMD"

Nope.

Intel is at least 6 months ahead of AMD.

Intel has 1.5 GHz CPUs NOW - and 1.7 GHz in a few weeks - on Aluminum/0.18 micron process.

Forget SOI - Intel claimed it didn't need copper on 0.18 micron process and INTEL PROVED it.

When Intel says it doesn't need SOI - you damn well better believe them, Dannie girl.

Intel will be shipping Tualatin - 0.13 micron copper chips in a few months.

However, by next year, when Intel starts manufacturing 300 MM wafer/0.13 micron wafers, Intel will have a TWO YEAR lead on AMD - maybe THREE years.

Then - AMD will have to start issuing debt - and getting old Joe Roby and DLJ to line up some new bond suckers to help build a 300 MM wafer fab.

Then, Interest expenses will start to consume AMD again.

Paul



To: Dan3 who wrote (132382)4/15/2001 2:18:28 AM
From: semiconeng  Read Replies (1) | Respond to of 186894
 
AMD started putting into place copper FAB technology with pod wafer handling equipment two years ago. It's about a third paid for already.

---So, you seem to be of the opinion that this "Pod Transport" is a big deal, it's not. The wafer transport system runs on a monorail near the ceiling, where the laminar airflow from the ceiling is highest. Our microcontamination people did testing, and found no difference between the Pod system, and the standard Wafer Lot Box transport system. The Pod system does have an advantage with 300mm wafers due to the size and weight of the standard 25 wafer box. But of course, AMD wouldn't know about that. Too bad their 200mm system can't be modified for 300mm and will be obsolete then.

50% of AMD's capacity is already equipped for pods, copper, and soon SOI.
Intel is hoping to bring its first smidgen of such capacity on line real-soon-now. They don't know when they can begin to hope for SOI. Intel is two years behind AMD.


---I've seen the data for SOI. If you're looking at this as the holy grail, you're going to be disappointed. To me, it seems to have a slight advantage, but the manufacturing costs are astronomical. Forget about cheap chips on that process.

Sander's timing was brilliant. Barretts's was not.

Dan


---If you say so Dan, after all, you're an expert at semiconductor manufacturing..... Not.

Semi