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To: Elmer who wrote (133958)5/2/2001 12:01:47 AM
From: fyodor_  Read Replies (1) | Respond to of 186894
 
Elmer: I have no idea.

It looks like it's a bit closer than I had expected... According to this article (http://www.siliconstrategies.com/story/OEG20010427S0040):

TSMC said two of its customers are already in
volume production at 0.13-micron design rules,
and seven more are being readied for production.
The company said it plans to have 40 more
0.13-micron designs in production by the third
quarter.


(source: siliconinvestor.com

There are a few other interesting tid-bits in that article. Apparently, UMC has opted for SiLK instead of FSG, whereas TSMC (like AMD) has chosen to go with Black Diamond. Additionally, UMC will offer embedded DRAM in its .13&#181 process, whereas TSMC is counting on 1T SRAM - at least for the time being.

-fyo