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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: Elmer who wrote (133961)	5/2/2001 12:24:46 AM
From: fyodor_	Read Replies (1) \| Respond to of 186894

Elmer: Sorry but I don't know what this means. "SiLK" and "Black Diamond" are two low-k dielectrics. Currently, both Intel and AMD (as well as most everyone else, AFAIK) use flouridated silicate glass (FSG). FSG has a dielectric constant (k) of 3.6. SiLK and Black Diamond have 2.65 and ~3, respectively. In this case, lower is better ;-). The problem with many low-k dielectrics, including SiLK, is that they are porous (and just generally a pain to work with - e.g. brittle and high thermal expansion coefficient). Black Diamond is supposed to be "almost" like FSG to work with (or at least that's what Applied Materials (who make it) claim ;-)). The main benefit of using low-k dielectrics is a reduction of the RC delay. AFAIK, Intel has chosen to continue with FSG for its .13µ process (but then the incredible aspect ratio of its "wires" may make up for it, for all I know). Other than that, there are others on this thread far more capable of providing finer details&#133 -fyo