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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: michael97123 who wrote (46412)	5/8/2001 11:38:21 AM
From: Proud_Infidel	Respond to of 70976

Low-k material sales will double to $200 million in 2004, says report Semiconductor Business News (05/08/01 11:22 a.m. EST) NEW TRIPOLI, Pa. -- Semiconductor industry revenues for low-k dielectric interconnect materials (below k ratings of 3.0) will reach $200 million in 2004, compared to $100 million in 2001, said a new market report from The Information Network here. According to the research firm, Dow Corning Corp.'s Fox spin-on dielectric films accounted for 50% of the low-k dielectric materials used with aluminum-metal interconnects on ICs during 2000. The battle for low-k dielectrics with copper interconnects is still being fought out by a number of suppliers, which are offering thin films for spin-on and chemical vapor deposition (CVD) processes. "Few semiconductor companies have been willing to risk a simultaneous technological move to both copper and low-k," noted Robert N. Castellano, president of The Information Network. "Therefore, most semiconductor companies have either chosen to move to copper integrated with standard SiO2 (silicon dioxide], or stay with aluminum and move to low-k. "Thus, the market is fragmented into two sectors -- aluminum/low-k and copper/low-k--with the aluminum/low-k sector dominating the market with a 97% share in 2000," he said. In 2004, copper and low-k insulators will become the dominate interconnect combination as more IC manufacturers move away from standard aluminum metal processes at the 0.13- and 0.10-micron technology nodes, said the research firm