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Technology Stocks : Intel Corporation (INTC) -- Ignore unavailable to you. Want to Upgrade?

To: dale_laroy who wrote (135060)	5/15/2001 11:02:31 AM
From: Elmer	Read Replies (1) \| Respond to of 186894

Not true, the TBirds manufactured at Fab25 have about the same layout as those at Fab30. Intel will probably do a new full layout of the interconnects, but much of the device layer could remain essentially unchanged. If the "device layer" remains the same then it isn't a shrink. The term shrink is usually used to mean a geometric scaling down of the device, nothing more. Changing the layout while scaling down is usually called a compaction. I don't believe Madison will be either because I don't think it will be just a .13u McKinley. EP