Silicon Investor (SI) -- The First Internet Community

STOCKTALK

We've detected that you're using an ad content blocking browser plug-in or feature. Ads provide a critical source of revenue to the continued operation of Silicon Investor. We ask that you disable ad blocking while on Silicon Investor in the best interests of our community. If you are not using an ad blocker but are still receiving this message, make sure your browser's tracking protection is set to the 'standard' level.

Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: THE WATSONYOUTH who wrote (40519)	5/19/2001 5:19:13 PM
From: ptanner	Respond to of 275872

TWY, Re: Emotion @ 238mm^2 You are correct that the size was from the article I linked to which was written during the days of 0.25 micron processes. I didn't look hard enough to find a more current link, but even with a process shrink it would still be much larger than the coppermine proposed for the X-Box. -PT

To: THE WATSONYOUTH who wrote (40519)	5/21/2001 1:14:01 AM
From: milo_morai	Read Replies (1) \| Respond to of 275872

<font color=green>Industry Divides on Low-k Dielectric Choices At a Glance At the 0.13 µm node, device manufacturers are split among those that will use an organic spin-on dielectric (SOD); those that will use silicate films, produced by PECVD or SOD; and those that will wait until future generations to use these new films. The ability to overcome extensive integration challenges and extend a material's performance will determine a company's long-term success at attaining a low effective dielectric constant (keff). Together with copper interconnects, low-k dielectrics deliver faster device speed and reduced crosstalk in advanced devices. Laura Peters, Senior Editor Full Story semiconductor.net M