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To: andreas_wonisch who wrote (40770)5/21/2001 5:32:30 PM
From: fyodor_Respond to of 275872
 
Andreas: Looks like they also develop a new technology (TransZip) that they will later replace with HyperTransport.

Well, from what I understand, they have "simply" taken the current implementation of HyperTransport and used that - possibly making small changes. Since HT is not completely finalized (?), they've simply chosen to implement it "as is". Since they don't really need any compatibility as such at this point (these chipsets will be for PIII, P4, Athlon and Duron processors, not Hammer).

When Hammer comes along, HT will (it must be assumed) be ready and the few changes necessary to comply fully with it will be relatively easy to implement.

Looking at the roadmap:

watch.impress.co.jp

What's SiS740? How will it be different that 735? It's supposed to be out "any-time-now", if I'm reading the roadmap correctly.

What about the tentatively named SiS750? Seems like there are an awful lot of chipsets (both AMD and Intel) in an awfully short time. And considering how well the 735 (which isn't even available in motherboards yet) has fared in preliminary benchmarks, I cannot understand why SiS feels it needs another 2 chipsets out for the same platform this year. And then there's that SiS315 and SiS961... presumably the former is an integrated chipset of some kind, but other than that...

-fyo



To: andreas_wonisch who wrote (40770)5/21/2001 8:03:56 PM
From: PetzRespond to of 275872
 
The SiS and VIA integrated chipset motherboards are suddenly much more available, but SiS seems more common. Based on that and the excellent reviews so far of their DDR chipset, SiS may become much more significant than they are now, and help to keep VIA more honest.

Petz