To: cblranch who wrote (9663 ) 5/22/2001 5:33:35 PM From: Tom Hua Read Replies (2) | Respond to of 19633 May 22, 2001 | This Topic Rodel Awarded Five New Patents in Polishing Technology [Business Wire] PHOENIX--(BUSINESS WIRE) via NewsEdge Corporation -- Rodel, Inc., an innovator of integrated materials for the microelectronics industry, today announced that it has been awarded five patents to date for 2001. With an aggressive patent program in place, Rodel protects its R&D investments and technological advancements. The company currently holds 52 patents and has 105 additional patents pending approval. Issued on April 17, 2001, U.S. Patent No. 6,218,305 covers the method and composition for polishing a composite of silica and silicon nitride. The polishing material is made up of an aqueous medium, abrasive particles, a surfactant, an organic polymer viscosity modifier and a complexing compound. U.S. Patent No. 6,217,434, also issued on April 17, 2001, protects Rodel's polishing pads used in the manufacture of semiconductor devices. The pads have an advantageous hydrophilic polishing material and an innovative surface topography and texture that improves predictability and polishing performance. Rodel was granted U.S. Patent No. 6,210,525 on April 3, 2001 protecting a CMP polishing pad. The pad has nanoasperities on its surface, which are particles with an imputed radius of curvature of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10 percent and contact the wafer surface in combination with a reactive liquid solution. Also issued on April 3, 2001, U.S. Patent No. 6,210,254 covers Rodel's polymeric polishing pad that uses photo-curing polymers and photolithography. The photolithography enables the creation of useful surface patterns not possible with conventional machining techniques and allows for the use of pad materials otherwise too soft to pattern by conventional machining techniques. Finally, U.S. Patent No. 6,171,181, issued on January 9, 2001, protects a molded polishing pad with an integral window. The polishing pad is formed as a one-piece article that has a transparent region and an adjacent opaque region. Solidifying a flowable polymeric material - which at least initially has a uniform composition - forms the article. The flowable polymeric material is processed during a molding operation to provide the transparent region and the adjacent opaque region. Types of polymeric material suitable for making the polishing pad include a single thermoplastic material, a blend of thermoplastic materials, and a reactive thermosetting polymer. Rodel's extensive collection of patents varies from innovations in silicon polishing slurry foundations, to enhancements for IC pad technology. The breadth of patents awarded to Rodel can be attributed to the company's creative and hard working group of inventors, who are continually developing and expanding the product and patent portfolio. For additional information on any of the patents, please visit the technology section of Rodel's website at www.rodel.com. Rodel, Inc. is an innovator of integrated materials for the microelectronics industry and global leader in polishing technology for semiconductors, silicon wafers and storage media substrates. The company has been a key supplier to the semiconductor industry since 1969. Rodel has operations throughout the United States, Asia and Europe with its global headquarters and Materials Integration Center in Phoenix, AZ, manufacturing operations and Materials Development Center in Newark, DE, and additional manufacturing facilities in Japan. Rodel is part of the Rohm and Haas Electronics Materials Group, which also includes the Shipley Company. Headquartered in Philadelphia, PA, Rohm and Haas is a $7 billion specialty chemical technology company. Rodel can be found on the Internet at www.rodel.com. <<Business Wire, 05-21-01, 13:37 Eastern>>