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To: dale_laroy who wrote (135963)5/23/2001 3:27:21 PM
From: Elmer  Respond to of 186894
 
My guess is that Intel will continue to use the PSM steppers where installed even after the 193nm Litho equipment begins to ship. They will simply continue the ramp with the original configuration using the 193nm Litho equipment for critical layers to produce their highest speed grades, while continuing to produce lower speed grades using PSM for the critical layers. Of course, towards the end of each fab's ramp they could switch to installing only 193nm Litho equipment in order to eliminate the less optimal PSM steppers.

Not likely. I don't believe Intel runs multiple fab recipes for different speed bins. One process, one recipe, copy exactly and target the highest speed possible. However the need for ultra low power may throw in an interesting twist.

EP