To: pat mudge who wrote (2277 ) 5/27/2001 7:04:17 PM From: richroni Read Replies (1) | Respond to of 2484 At the beginning of the March Q, they had 5,713M in cash and subsequently added $11,394M Are you sure it wasn't 23.445 million USsec.gov This also may be of interest to investors: THE LUMENON SOLUTION We design, manufacture and market optical components solutions that generate, detect, route and control light signals in telecommunications networks that use light-carrying fiber-optic cables instead of electrical copper wires. Specifically, our solutions take the form of circuits that have been etched on silicon chips through a patented sol-gel manufacturing process that we call PHASIC(TM). By using silicon chips, we can take advantage of standard, high volume semiconductor production methods and processes. While traditional fiber-optic component manufacturers combine discrete elements, such as lasers, lenses and filters, in manually assembled devices, we can achieve the same functionality in a single integrated chip with our proprietary silicon-based optical circuitry. The process is similar to the design and production of microelectronic chips widely used in computers and telecommunication applications. We have chosen the optical silicon chip for our product development because we believe that our PHASIC(TM) process will allow us to address specific market demands, such as: Scalable, High Volume Production. Our technology permits a wide variety of optical components to be manufactured using established process steps developed by the semiconductor industry. These process steps permit rapid production schedules and offer opportunities for economies of scale. Higher Performance. The combination of many optical functions on a single optical chip reduces the losses in optical power that generally occur when light is processed through a combination of discrete components and allows increased precision and control over the optical signals. Compact Size. Because it takes advantage of the compactness of silicon chips, our technology allows us to reduce considerably the overall size of fiber-optic components. Lower Cost. By using high volume processing techniques, our devices benefit from cost advantages similar to those experienced with high volume electronic silicon chip manufacturing. Simplified Packaging. Conventional optical devices require considerable technical skill and manual manipulation to attach and align the optical fiber. Our technology allows for a much simpler fiber attachment, resulting in easier and quicker device packaging and interfacing. Reliability. Integrating all components and functions onto a single chip reduces the number of interfaces between separate components, which improves overall functional reliability.sec.gov