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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Proud_Infidel who wrote (47455)	5/30/2001 10:30:18 PM
From: Big Bucks	Respond to of 70976

Of interest concerning NVLS Wednesday May 30, 4:42 pm Eastern Time Press Release SOURCE: Novellus Systems Inc. Novellus Receives Orders for Multiple INOVA xT(R) PVD Systems From Infineon Technologies for Its Global 300-mm Memory Fabs INOVA xT Selected as Process Tool of Record for Liner/Barrier and Aluminum Interconnect Applications SAN JOSE, Calif., May 30 /PRNewswire/ -- Novellus Systems Inc. (Nasdaq: NVLS - news), the productivity and innovation leader in advanced deposition and surface preparation processes for the global semiconductor industry, today announced that Infineon Technologies (NYSE: IFX - news) has selected the INOVA xT® physical vapor deposition (PVD) system for use in its 300-mm advanced liner/barrier and aluminum interconnect manufacturing processes. The INOVA xT system will be used in dynamic random access memory (DRAM) production at Infineon's 300-mm wafer fabrication facilities in Dresden, Germany; Hsinchu, Taiwan; and Richmond, Va. ``The INOVA xT system's high productivity and the improved device yields achieved with the tool's hollow cathode magnetron (HCM(TM)) technology were key factors in our selection,'' said Harald Eggers, vice president and general manager of the memory product group at Infineon. ``In addition, the INOVA xT's superior process performance and production-worthiness were clearly demonstrated during its rapid installation and integration into the production line at our SC 300 facility in Dresden.'' A high-productivity 300-mm metallization system, the INOVA xT enables both subtractive aluminum and copper dual damascene deposition processes. Its unique system architecture maximizes wafer throughput via improved wafer handling and reduces non-value-added time. The INOVA xT has demonstrated a throughput of 100 wafers per hour for multiple PVD films, an industry-leading figure. In addition, its HCM source technology offers extendibility to the 0.10-micron node and below. ``The INOVA xT system, with HCM technology offers a unique combination of innovative process technology and high productivity,'' said Dr. Julian Hsieh, vice president and general manager of Novellus' Integrated Metals Division. ``This combination has resulted in a PVD tool with double the throughput of the closest competing tool, as well as the lowest cost of ownership in the industry. We are delighted that Infineon has selected our tool for its 300-mm production. We believe Infineon's choice of the INOVA xT for its 300-mm DRAM applications demonstrates the growing acceptance of Novellus' PVD technology.''