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To: Dan3 who wrote (137998)	6/24/2001 9:54:11 PM
From: fyodor_	Respond to of 186894

Dan: AMD, by every indication, could have been ready to go with an Intel-style straight .13 copper process last fall. ................. uhmmm...... I know it's been said before, but I honestly hope you are joking. If not, you may want to have a look at the following site and check if you are coming into contact with any of the substances: usdoj.gov -fyo

To: Dan3 who wrote (137998)	6/24/2001 11:06:32 PM
From: dale_laroy	Respond to of 186894

>AMD, by every indication, could have been ready to go with an Intel-style straight .13 copper process last fall. Instead, they performed that panicky scramble to bolt a FAB extension to the roof of FAB 30 so they could add SOI to their .13 process.< Dream on. AMD never claimed they could get to 0.13-micron last Fall. Even before they decided they needed 193nm lithography equipment for the critical mask steps they were projecting H1 2001. Then again, it could have been that the reason AMD felt they needed 193nm lithography is that they would have benefited little from a process similar to Intel's Tualatin 0.13-micron process. It appears that all the advantages of Intel's 0.13-micron process may be coming from the transition to copper. If this is true, since AMD is already using copper, they would have realized no advantage at all.