To: Paul Engel who wrote (138222 ) 6/26/2001 9:26:30 PM From: puborectalis Respond to of 186894 Intel plans $2 billion Oregon plant By The Associated Press Special to CNET News.com June 26, 2001, 4:15 p.m. PT HIlLSBORO, Ore.--Intel plans to begin construction on a $2 billion semiconductor plant in Oregon this summer. The company filed a development-review application Friday with Hillsboro, Ore., officials for the three-story, 175,000-square-foot facility. Intel said it hopes to have a concrete slab and part of the building shell in place by the end of this year. Company spokesman Bill MacKenzie said the plant wouldn’t open until 2003, when the economic dip will have passed. "If the market continues to show weakness through the balance of this year, you won't see the project move that fast," he added. The new plant will likely create 3,000 jobs in the area, he said. Santa Clara, Calif.-based Intel has its largest base of operations in Hillsboro, and its Oregon facilities employ about 16,000. "Even in a worst-case scenario with the chip market, they still have to do this," said George Burns, a consultant with Strategic Marketing Associates. "You want to do the development phase right. Otherwise, you get all kinds of screw-ups down the line when you get into volume manufacturing." Intel's manufacturing strategy is to create an experimental fabrication plant where it will perfect new production processes, then quickly transform it into a high-volume manufacturing facility while deploying technologies developed there throughout the company in a process known as copy exact. This spring, the company opened a new development plant, D1C. It was one of the first chip plants in the world designed to make chips with circuits measuring 0.13 microns--about one-thousandth the width of a human hair--on larger 300-millimeter silicon wafers. The 300-millimeter wafers have 225 percent more surface area than the current standard, and they should cut Intel's manufacturing costs by 30 percent to 35 percent when D1C goes into full production next year or in 2003. The new plant, known as D1D, will also use 300mm wafers.