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Politics : Formerly About Applied Materials -- Ignore unavailable to you. Want to Upgrade?

To: Paul V. who wrote (48798)	7/6/2001 4:51:06 PM
From: Proud_Infidel	Respond to of 70976

IBM, Seiko move ahead with 300-mm fab plans in Japan Semiconductor Business News (07/06/01 08:13 a.m. EST) TOKYO -- IBM Corp. and Seiko Epson Corp. here have reached a final agreement on previously announced plans to set up a joint-venture 300-mm wafer fab in Japan. The total cost of the chip-making facility is expected to be over $1 billion. The new venture--called Yasu Semiconductor Corp.--will equip the 300-mm (12-inch) fab for 0.13-micron processes by 2003, according to the two companies. Originally announced several weeks ago, the joint venture will be located at IBM Japan Ltd.'s site in Yasu. The venture will build integrated circuits for mobile devices, Internet appliances and other products.