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Technology Stocks : Advanced Micro Devices - Moderated (AMD) -- Ignore unavailable to you. Want to Upgrade?

To: combjelly who wrote (48245)	7/18/2001 4:19:18 PM
From: Ali Chen	Respond to of 275872

"Which is why I qualified the statement." I am sorry if you took offense on this one, it is just my bad style. I am really sorry, I actually was trying to make a joke. "While I knew that the Coppermines were originally in an organic package, I wasn't sure if that had changed with later, more power hungry parts." As far as I saw, they put a thermal slab on recent 1.13MHz Coppermines. Really useful stuff, I believe made of copper no less. I think AMD needs to return back to K-6 style thermal spreaders, but copper-made. It will relieve requirements for third-party heatsinks, lessen failure rate during OEM installation, etc. etc. Of course, the move to plastic raises many other mechanical concerns like thermal expansion coefficient inequalities, lower Young modulus [sp?] to hold the pressure from attached heat sink etc. BTW, pins and plastic substrate are parts of the same thermal path. Regards, - Ali