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To: Jon Khymn who wrote (76294)7/28/2001 7:00:18 PM
From: Bilow  Read Replies (2) | Respond to of 93625
 
Hi Web Myst; The next big thing is the elimination of PCB as a means of connecting chips together.

The change we're going through right now is the effect of the crash in the cost of pins. (Pins used to be individually connected to chips, at first by women in asian factories, then by robots, but now they're "bumped" together which means they're all done at one time.) One of the companies that is big in this is Tessera, their technology was necessary for RDRAM. I think they're private, but they would be in a "tornado" right about now. As usual, mom and pop can't get in on the ground floor. (Note that Rambus didn't go public for 6 years, and when they finally did, it wasn't because they needed the cash. The reason Rambus went public was to cash out the founders by selling stock to the public.)

But the problem with high pin counts on chips is that it means that the PCBs have to increase their layer count in order for the traces to "escape" from under the chip. This increases the price of PCBs. (All engineering is about tradeoffs, of course.)

So the next big area for advancement is the improvement or replacement of PCB technology. Do a google search on "MCM module multi chip" and see what pops up. But don't imagine that you're going to find any great investing opportunities out there. This technology is one of the obvious contenders for the next big thing, and that means that the venture capital people aren't going to let you get near it. Best bet would be to apply for work, even as a grunt, at the right company, LOL!

-- Carl

P.S. Link to Tessera:
tessera.com