To: kapkan4u who wrote (49695 ) 8/2/2001 8:07:35 PM From: combjelly Read Replies (1) | Respond to of 275872 "Designing Hammers exclusively for SOI, constructing an additional floor at Dresden and stuffing it with oxygen implanters is not a bit deal for you?" We don't have enough details with respect to AMD's process to make guesses at this point. IBM indicates that the "floating body" effect can be used to great advantage if you use it instead of fighting it. It is not clear that Intel, for one, ever figured out how to do that, and that very well may be the IP that AMD paid for. If you examine both TI's and Intel's objections to SOI, they seem to feel that the "floating body" effect is the limit at smaller geometries... But even if the "floating body" effect becomes a limitation below 70nm, AMD still would get full use out of Dresden and at least 3 generations with an advantage, however small, over a bulk process. Look at copper on 0.18 micron, Intel claimed it offered no advantage, but unless AMD is sandbagging, they cannot get their Al process in Austin to clock with their Cu process in Dresden. Yeah, I know, the 90nm or better Leff that Dresden has is the key, but I think it is obvious that Cu allows that Leff where Al doesn't. And if AMD had a 20(sometimes 27, depending on a hit to the trace cache) stage processor like the P4, I suspect they could be turning out 2.5GHz processors right now in Dresden while Intel will need 0.13 micron to do the same. If AMD is implanting their own wafers, then they had better have a solution to the pinhole problem. If they are growing SOI in situ as Hans DeVries suggest, then who knows what can crop up? AMD seems awful confident about SOI, which is sorta scary...