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Technology Stocks : Lam Research (LRCX, NASDAQ): To the Insiders -- Ignore unavailable to you. Want to Upgrade?


To: Kirk © who wrote (4699)8/8/2001 7:24:03 AM
From: Proud_Infidel  Respond to of 5867
 
Lam and KLA-Tencor Announce Program for Integrated Metrology at 300 MM
Program Will Target Improving Yields and Overall Equipment Effectiveness (OEE) For Sub-100 Nanometer Processes
FREMONT, Calif. and SAN JOSE, Calif., Aug. 7 /PRNewswire/ -- Lam Research Corporation (Nasdaq: LRCX - news), Fremont, Calif., and KLA-Tencor Corporation (Nasdaq: KLAC - news), San Jose, Calif., today announced they have established a program to integrate a range of KLA-Tencor's metrology capabilities on Lam's 2300(TM) product family. The program, which began several months ago, initially will add metrology capability to Lam's 2300 etch systems, including critical dimension (CD) and coating thickness uniformity monitoring. Incorporating KLA-Tencor's metrology technology on Lam's process equipment will enhance process performance control to improve sub-100 nanometer device yields and OEE.

According to Nick Bright, vice president and general manager of Lam's Etch Products Group, ``The overlap in 300 mm implementation and sub-100 nm process development is driving the industry need for integrated metrology solutions. These technology transitions represent the junctions where the high costs of 300 mm processes and the challenge of increasing the yield of high-performance devices begin to make integrating metrology cost effective.''

``Yet, in order to provide an advantage to chip manufacturers, integrated metrology must include superior measurement capability, fab-wide recipe sharing, matching with stand-alone tools, and advanced process control software and expertise. KLA-Tencor has the experience as well as the market and technology leadership to meet these criteria and make integrated metrology a truly production-worthy solution for etch processing. With process equipment-neutral metrology systems installed in every fab, KLA-Tencor was the obvious choice for developing integrated metrology capabilities for our 2300 product family,'' Bright continued.

Officials from both companies agree that integrated metrology can enhance overall fab efficiency by eliminating the bottleneck of off-line metrology, reducing rework and cycle times, and minimizing the consumption of monitor wafers. It also enables engineers to implement ``feed-forward'' and feedback process control, using incoming or post-process measurements, respectively, so that any necessary process adjustments can be made immediately. During the gate etch process, for example, these advanced process control techniques can be used to quickly correct variations in gate length, which impact the speed and performance of devices.

``Semiconductor manufacturers face significant challenges and risks in bringing 300 mm and sub-100 nanometer processes into production,'' stated Dennis Fortino, executive vice president, Optical Surface Inspection and Measurement Group, at KLA-Tencor. ``This includes maintaining parameters within ever-tightening process windows while keeping pace with accelerating product life cycles. In certain applications, such as etch, where CD and thin-film uniformity are critical to the success of the process, integrated process control can help chip manufacturers overcome these challenges.''

``Lam has consistently been an industry leader for etch, offering advanced technologies and integrating new capabilities onto its systems over the years. Its foresight in recognizing the benefits of integrated metrology is the latest example of the company's continuing efforts to innovate and offer advanced capability in all of its product lines,'' Fortino concluded.

This press release contains certain forward-looking statements which are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements include those relating to process and machine performance, process developments, the challenges facing chip manufacturers, and the value of integrated metrology, among others. Such statements are based on current expectations and are subject to risks, uncertainties, and changes in condition, significance, value and effect including those risks detailed in documents filed with the Securities and Exchange Commission, which could cause actual results to vary from expectations. Neither Lam nor KLA-Tencor undertake any obligation to update the information in this press release.

About Lam

Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the world's semiconductor industry. Lam's common stock trades on the Nasdaq National Market under the symbol LRCX. The Company's World Wide Web address is lamrc.com .

About KLA-Tencor

KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, Calif., the company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the Nasdaq National Market under the symbol KLAC.

SOURCE: Lam Research Corporation



To: Kirk © who wrote (4699)8/21/2001 2:59:48 PM
From: Proud_Infidel  Respond to of 5867
 
Tue Aug 21 LRCX Coverage initiated on Lam Research by Dain Rauscher Wessels - Briefing.com



To: Kirk © who wrote (4699)8/27/2001 2:44:00 PM
From: Proud_Infidel  Respond to of 5867
 
Lam mentioned as a promising pick:

Chip-equipment firms with new tech to fare best
By Duncan Martell

SAN FRANCISCO, Aug 27 (Reuters) - Okay, so most of the chips are down, but not all of them.

While the semiconductor industry is poised to post a record decline in revenue this year and the chip equipment sector has suffered as well, those companies that have the equipment to make circuits for a new generation of electronics products are still posting sales gains, albeit at a reduced level.

Chip makers have been hit by weakening demand for personal computers and cellular handsets, as well as a sharp slowdown in the flood of spending in telecommunications gear.

That means companies such as Intel Corp. (NasdaqNM:INTC - news), National Semiconductor Corp. (NYSE:NSM - news), LSI Logic Corp. (NYSE:LSI - news) and others are cutting jobs, closing plants either permanently or temporarily and taking other cost-cutting measures.

But as chip demand slumps, the industry is also in the middle of a shift to newer technology -- a cycle that happens every few years and requires chipmakers to spend billions of dollars to get the latest equipment.

This time, it's the move to smaller line widths on chips, where some dimensions are 0.13 microns wide (a human hair, by comparison, is about 100 microns across), larger, dinner-plate-sized silicon wafers and a continuing roll-out of chips using copper interconnections rather than aluminum.

``No one is spending money on capacity (to produce a greater number of existing products) anymore,'' said Merrill Lynch chip-equipment analyst Brett Hodess. ``They're only spending on new technology.''

FASTER, CHEAPER CHIPS

The ``new thing'' is to make more powerful chips more cheaply, the same elusive goal that the industry is always chasing.

But Intel won't see the cost of making its Pentium 4 microprocessor really come down until it moves to 0.13 micron process technology early next year.

The smaller line widths allow for more transistors to be put on a single chip while the larger silicon wafers mean more chips can be gotten out of a single wafer. Copper is a better conductor than aluminum, also helping to boost performance.

Applied Materials Inc.'s (NasdaqNM:AMAT - news) Chairman and Chief Executive James Morgan said as much in May, when the world's biggest chip-equipment maker reported fiscal second-quarter results. While Applied saw sales and profits drop, it's continued to spend aggressively to develop the latest products so it's best prepared when demand returns.

``Our customers are really under pressure to invest for the next round of technology,'' Morgan told Reuters then in an interview.

He said much the same thing again on Aug. 14, when the company reported fiscal third-quarter results. ``I've never seen a time when there's been such a depth and breadth of technology purchases by our customers in the pilot line stage,'' Morgan told Reuters. ``This should really benefit us.''

SPECIAL LOW-K

In addition to Applied, whose equipment spans 75 percent of the chipmaking process, KLA-Tencor Corp. (NasdaqNM:KLAC - news) and Novellus Systems Inc. (NasdaqNM:NVLS - news) also are well prepared with the latest in chipmaking equipment, analysts said.

``Those companies are highly leveraged toward those new technologies,'' such as copper, so-called low-k dielectric, Hodess said, who upgraded those three companies, among others, earlier in the week. ``Both are necessary as you start to move to 0.13 micron and down below.''

In a nutshell, the lower k is, the lower the capacitance, which is good. Capacitance is a measurement of things that slow down signals, degrades them, couples one signal onto another signal line and burns power for no good reason.

When moving to smaller geometries, the capacitance gets larger relative to the size of certain parts of the chip, so it will influence circuit behavior more in a 0.13 micron chip than in a 0.18 micron chip.

Chip-equipment makers, and investors, will embrace whatever demand is out there, as the chip industry is forecast by some to contract, in revenue, by as much as 29 percent this year.

JUNE GLOOM

This year's June decline in worldwide chip sales of 8.8 percent from May is the worst-ever decline for a June over the past 17 years, and The previous worst June was in 1996, which was down 5.6 percent from May.

The dismal sales figures prompted Credit Suisse First Boston analyst Charlie Glavin to revise again his sales forecast for 2001 chip sales. He now expects them to fall 29 percent from last year, more than his previous estimate for a 25 percent decline.

``The rapid acceleration of new semiconductor technology could lead to a technology product cycle in 2002,'' wrote Lehman Brothers analyst Edmund White in a recent report. ``Next year will see the commercialization of 0.13 micron processing technology.''

``The move to copper processing is an important theme at Novellus (and one which could help it increase its share of the wafer processing equipment market), but more broadly the company is focusing its activities on being a strong fine linewidth technology enabler,'' White wrote.

Lam Research Corp.(NasdaqNM:LRCX - news), another chip-equipment maker, is also poised to do better, one analyst said.

``Lam is in way better shape with more new products than they were in the last downturn,'' said Bear Stearns analyst Robert Maire.



To: Kirk © who wrote (4699)8/31/2001 6:54:18 PM
From: Proud_Infidel  Read Replies (1) | Respond to of 5867
 
Friday August 31, 5:01 pm Eastern Time
Press Release
SOURCE: Lam Research Corporation
Lam Research Corporation Announces Additional Cost Savings Activities
FREMONT, Calif.--(BUSINESS WIRE)--Aug. 31, 2001--Lam Research Corporation (Nasdaq: LRCX - news) today announced that it is implementing additional cost savings measures to better align the company's operations with current market conditions. In addition to a reduction in force, which will impact approximately 10 percent of global employees, Lam is pursuing several initiatives to lower operating expenses. These include company-wide shutdown days, voluntary pay reductions, and employee furloughs. The company will record a restructuring charge against financial results for the quarter ending September 23, 2001.

``Current industry conditions warrant a conservative approach to cost management, while the cyclical nature of our business demands flexibility as well,'' stated James W. Bagley, Lam's chairman and chief executive officer.

``Downturns are a time to introduce new products and win market share. We are actively engaged with our customers on next-generation development work for the transition to copper and other new materials. In addition, the move to 300 mm wafer processing is underway. Our recently introduced suite of 2300 products is 200 mm and 300 mm capable and offers our customers key cost and technology benefits on both wafer sizes. The 2300 products are being very well received, and we expect our market share to reflect these early successes when growth in industry spending resumes,'' Bagley concluded.

This press release contains certain forward-looking statements which are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate generally to Lam's product developments, future market conditions or trends, market share estimates, and the impact of any marketing programs, product introductions or cost reduction efforts. Such statements are based on current expectations and are subject to risks, uncertainties, and changes in condition, and other risks detailed in documents filed with the Securities and Exchange Commission, including specifically the report on Form 10-K for the year ended June 25, 2000, and the Form 10-Q for the quarter ended March 25, 2001. The company undertakes no obligation to update the information in this Press Release.

Lam Research Corporation is a leading supplier of wafer fabrication equipment and services to the world's semiconductor industry. Lam's common stock trades on the Nasdaq National Market under the symbol LRCX. The Company's World Wide Web address is lamrc.com.